Aspects of Applying Flip-Chip Technology for SiC Power Devices Assembly

被引：0
|
作者：
Mysliwiec, Marcin [1 ,2 ]
Guziewicz, Marek [2 ]
Kisiel, Ryszard [1 ]
机构：
[1] Warsaw Univ Technol, Inst Microelect & Optoelect, Warsaw, Poland
[2] Inst Electr Mat Technol, Warsaw, Poland
来源：
2013 PROCEEDINGS OF THE 36TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2013年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The aim of our paper is to consider the possibility of applying flip-chip technology for assembly of SiC Schottky diode into a ceramic package. Ag micropowder was used for assembly SiC structure to DBC interposer of the ceramic package. Ag or Au balls were used as flip-chip connection material. The parameters of I-V characteristics were used as a quality factor to determine the Schottky diode after hermetization into ceramic package in comparison with bare SiC diode.
引用
收藏
页码：90 / 93
页数：4
相关论文
共 50 条
  • [31] Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
    Huang, Shirong
    Zhang, Yong
    Sun, Shuangxi
    Fan, Xiaogang
    Wang, Ling
    Fu, Yifeng
    Zhang, Yan
    Liu, Johan
    PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 347 - 352
  • [32] Open ended microwave oven for flip-chip assembly
    Sinclair, K. I.
    Sangster, A. J.
    Goussetis, G.
    Desmulliez, M. P. Y.
    Tilford, T.
    Parrott, A. K.
    Bailey, C.
    2007 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-4, 2007, : 620 - +
  • [33] LED flip-chip assembly with electroplated AuSn alloy
    Maaskant, PP
    Akhter, M
    Cordero, N
    Casey, DP
    Rohan, JF
    Roycroft, BJ
    Corbett, BM
    Physica Status Solidi C - Conferences and Critical Reviews, Vol 2, No 7, 2005, 2 (07): : 2907 - 2911
  • [34] A flip-chip LIGA assembly technique via electroplating
    L.-W. Pan
    L. Lin
    J. Ni
    Microsystem Technologies, 2001, 7 : 40 - 43
  • [35] Gallium alloy interconnects for flip-chip assembly applications
    Georgia Inst of Technology, Atlanta, United States
    Proc Electron Compon Technol Conf, (1143-1150):
  • [36] Gallium alloy interconnects for flip-chip assembly applications
    Baldwin, DF
    Deshmukh, RD
    Hau, CS
    46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 1143 - 1150
  • [37] Flip-chip BGA assembly process and reliability improvements
    Thompson, P
    Koehler, C
    Petras, M
    Solis, C
    NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 84 - 90
  • [38] Gallium alloy interconnects for flip-chip assembly applications
    Baldwin, DF
    Deshmukh, RD
    Hau, CS
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (02): : 360 - 366
  • [39] Gallium-based interconnects for flip-chip assembly
    Stanfield, AA
    Mannan, SH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 1998, 10 (03) : 18 - +
  • [40] Study of RF flip-chip assembly with underfill epoxy
    Zhang, WG
    Su, BZ
    Feng, ZP
    Gupta, KC
    Lee, YC
    1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 53 - 57
12345