An apparatus for loss measurement of integrated power electronics modules: Design and analysis

被引：0
|
作者：
Chen, G [1 ]
Xiao, CC [1 ]
Odendaal, WG [1 ]
机构：
[1] Virginia Polytech Inst & State Univ, Ctr Power Elect Syst, Blacksburg, VA 24061 USA
来源：
CONFERENCE RECORD OF THE 2002 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-4 | 2002年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
A calorimetry-based apparatus for accurate loss measurement of integrated power electronics modules (IPEMs) is presented. The IPEM is placed in a closed chamber, and a heat flux sensor is implemented to measure the total heat generated in the IPEM. Thermoelectric modules are introduced to cool the IPEM and control the operating temperature of the IPEM. The temperature difference between two polished covers in the apparatus is controlled in order to reduce the measurement error caused by convection and radiation. The design and analysis of the proposed apparatus, which can measure losses up to SOW is described below.
引用
收藏
页码：222 / 226
页数：5
相关论文
共 50 条
  • [41] Capacitor loss analysis method for power electronics converters
    Matsumori, H.
    Urata, K.
    Shimizu, T.
    Takano, K.
    Ishii, H.
    MICROELECTRONICS RELIABILITY, 2018, 88-90 : 443 - 446
  • [42] Electromagnetic design optimization of planar integrated power passive modules
    Strydom, JT
    van Wyk, JD
    PESC'02: 2002 IEEE 33RD ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-4, CONFERENCE PROCEEDINGS, 2002, : 573 - 578
  • [43] An Alternative Calorimetric Approach for Power Loss Measurement of Ultra-efficient Power Electronics
    Alimawi, Madhat
    Grootjans, Roelof
    Rietveld, Gert
    2024 CONFERENCE ON PRECISION ELECTROMAGNETIC MEASUREMENTS, CPEM 2024, 2024,
  • [44] Model-Based Design and Analysis of a Navy Integrated Power Electronics Building Block (NiPEBB)
    Lawson, Marie
    Moaz, Taha
    Rajagopal, Narayanan
    Mitrovic, Vladimir
    Dong, Dong
    Dimarino, Christina
    IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION, 2024, 10 (04): : 7816 - 7827
  • [45] Power modules as key component group for power electronics
    Majumdar, Gourab
    2007 Power Conversion Conference - Nagoya, Vols 1-3, 2007, : 1648 - 1655
  • [46] Failure Analysis of Power Integrated Modules and its Challenges
    De la Cruz, E. J.
    Yusof, N. T.
    Wong, W. Y.
    Arifen, N. I. Mohd
    Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, : 395 - 399
  • [47] DBC Substrate in Si- and SiC-based Power Electronics Modules: Design, Fabrication and Failure Analysis
    Xu, Ling
    Zhou, Yang
    Liu, Sheng
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1341 - 1345
  • [48] An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method
    Nwanoro, Kenneth Chimezie
    Lu, Hua
    Yin, Chunyan
    Bailey, Chris
    MICROELECTRONICS RELIABILITY, 2018, 87 : 1 - 14
  • [49] Thermal measurement and numerical analysis for automotive power modules
    Sitta, Alessandro
    Renna, Marco
    Messina, Angelo Alberto
    Sequenzia, Gaetano
    D'Arrigo, Giuseppe
    Calabretta, Michele
    2020 21ST INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2020,
  • [50] Electro-Thermal Model of Integrated Power Electronics Modules Based on an Innovative Layered Approach
    Greco, Giuseppe
    Vinci, Giovanni
    Bazzano, Gaetano
    Raciti, Angelo
    Cristaldi, Davide
    39TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY (IECON 2013), 2013, : 712 - 717
12345