A Single-Chip 8-Band CMOS Transceiver for 3G Cellular Systems with Digital Interface

被引:2
|
作者
Yoshida, Hiroshi [1 ]
Toyoda, Takehiko [1 ]
Tsurumi, Hiroshi [1 ]
Itoh, Nobuyuki [1 ]
机构
[1] Toshiba Co Ltd, Kawasaki, Kanagawa 2108520, Japan
关键词
W-CDMA; GSM; 3G; direct conversion; DC offset; AGC;
D O I
10.1587/transfun.E93.A.375
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, a single-chip dual-mode 8-band 130 nm CMOS transceiver including A/D/A converters and digital filters with 312 MHz LVDS interface is presented. For a transmitter chain, linear direct quadrature modulation architecture is introduced for both W-CDMA/HSDPA (High Speed Uplink Packet Access) and for GSM/EDGE. Analog baseband LPFs and quadrature modulators are commonly used both for GSM and for EDGE. For a direct conversion receiver chain, AB B (Analog Base-Band) blocks, i.e., LPFs and VGAs, delta-sigma A/D converters, and FIR filters are commonly used for W-CDMA/HSDPA (High Speed Downlink Packet Access) and GSM/EDGE to reduce chip area. Their characteristics can be reconfigured by register-based control sequence. The receiver chain also includes high-speed DC offset cancellers both in analog and in digital stage, and the self-contained AGC controller, whose parameters such as time constant are programmable to be free from DBB (Digital Base-Band) control. The transceiver also includes wide-range VCOs and fractional PLLs, an LVDS driver and receiver for high-speed digital interface of 312 MHz. Measured results reveal that the transceiver satisfies 3GPP specifications for W-CDMA/HSPA (High Speed Packet Access) and GSM/EDGE.
引用
收藏
页码:375 / 381
页数:7
相关论文
共 32 条
  • [21] A single-chip dual-band CDMA2000 receiver for cellular terminals in 0.13 μm CMOS
    Hueber, Gernot
    Zipper, Josef
    Holm, Andreas
    2007 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, VOLS 1 AND 2, 2007, : 414 - +
  • [22] A Reconfigurable Analog Baseband for Single-chip, Saw-less, 2G/3G/4G Cellular Transceivers with Carrier Aggregation
    Lee, Jongwoo
    Han, Byungki
    Lim, Jae-hyun
    Ahn, Su-seob
    Kim, Jae-kwon
    Cho, Thomas
    2014 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC), 2014, : 9 - 12
  • [23] MIXED DIGITAL ANALOG SIGNAL-PROCESSING FOR A SINGLE-CHIP 2B1Q U-INTERFACE TRANSCEIVER
    BATRUNI, R
    LEMAITRE, P
    FENSCH, T
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1990, 25 (06) : 1414 - 1425
  • [24] A Low-Cost Quad-Band Single-Chip GSM/GPRS Radio in 90nm Digital CMOS
    Muhammad, K.
    Hung, C. -M.
    Leipold, D.
    Mayhugh, T.
    Elahi, I.
    Deng, I.
    Fernando, C.
    Lee, M. -C.
    Murphy, T.
    Wallberg, J. L.
    Staszewski, R. B.
    Larson, S.
    Jung, T.
    Cruise, P.
    Roussel, V.
    Vemulapalli, S. K.
    Staszewski, R.
    Eliezer, O. E.
    Feygin, G.
    Kunz, K.
    Maggio, K.
    RFIC: 2009 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM, 2009, : 175 - 178
  • [25] A SINGLE-CHIP 12.7-MCHIPS/S DIGITAL IF BPSK DIRECT-SEQUENCE SPREAD-SPECTRUM TRANSCEIVER IN 1.2-MU-M CMOS
    CHIEN, C
    JAIN, R
    COHEN, EG
    SAMUELI, H
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1994, 29 (12) : 1614 - 1623
  • [26] A single-chip, 5.15GHz-5.35GHz, 2.4GHz-2.5GHz, 0.18μm CMOS RF transceiver for 802.11a/b/g wireless LAN
    Vavelidis, K
    Vassiliou, I
    Georgantas, T
    Yamanaka, A
    Kavadias, S
    Kamoulakos, G
    Kapnistis, C
    Kokolakis, Y
    Kyranas, A
    Merakos, P
    Bouras, I
    Bouras, S
    Plevridis, S
    Haralabidis, N
    ESSCIRC 2003: PROCEEDINGS OF THE 29TH EUROPEAN SOLID-STATE CIRCUITS CONFERENCE, 2003, : 221 - 224
  • [27] Highly integrated RF-ICs for digital cellular 2G and 3G and cordless systems - A status review and development trends
    Fenk, J
    2001 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS, PROCEEDINGS OF TECHNICAL PAPERS, 2001, : 121 - 124
  • [28] Single-Chip WiFi b/g/n 1x2 SoC with Fully Integrated Front-end & PMU in 90nm digital CMOS technology
    Jensen, J. C.
    Sadhwani, R.
    Kidwai, A. A.
    Jann, B.
    Oster, A.
    Sharkansky, M.
    Ben-bassat, I.
    Degani, O.
    Porat, S.
    Fridman, A.
    Shang, H.
    Chu, C.
    Ly, A.
    Smith, M.
    2010 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS RFIC SYMPOSIUM, 2010, : 447 - 450
  • [29] A Highly Reconfigurable 65nm CMOS RF-to-Bits Transceiver for Full-Band Multicarrier TDD/FDD 2G/3G/4G/5G Macro Basestations
    McLaurin, David J.
    Gard, Kevin G.
    Schubert, Richard P.
    Manglani, Manish J.
    Zhu, Haiyang
    Alldred, David
    Li, Zhao
    Bal, Steven R.
    Fan, Jianxun
    Gysel, Oliver E.
    Mayer, Christopher M.
    Montalvo, Tony
    2018 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE - (ISSCC), 2018, : 162 - +
  • [30] A 3G PMR Tetrapol-Tetra-Apco25 multi-mode analog base-band chip in CMOS 0.18um technology
    Bourdillat, JP
    Dura, R
    Gaussourges, A
    Fievet, S
    Gokoglu, S
    Guilbert, P
    Marais, E
    Marczak, JM
    Rivoir, R
    Roy, PY
    Sevrin, JM
    Tarnand, C
    16TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, 2004, : 32 - 36