RF front-end modules in cellular handsets

被引：0
|
作者：
Gu, WCA [1 ]
机构：
[1] TriQuint Semicond, Sawtek Div, Apopka, FL 32703 USA
来源：
2004 IEEE CSIC SYMPOSIUM, TECHNICAL DIGEST 2004: 26TH ANNIVERSARY: COMPOUNDING YOUR CHIPS IN MONTEREY | 2004年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Radio portion of the cellular handsets have evolved from a nearly all-discrete implementation towards a very high level of integration in baseband IC, transceiver ICs and firont-end (FE) modules. Integration allows handsets designers to pack more functionalities into a smaller volume with reduced bills of material (BOM) and costs. This paper will first review the FE modules for the 2(nd) generation (2G) handsets followed by a discussion of future trend of FE integration in the emerging multi-band, multi-mode phones for the 2.5G and 3G systems.
引用
收藏
页码：225 / 228
页数：4
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