3D Transformable Modular Kirigami Based Programmable Metamaterials

被引:57
|
作者
Li, Yanbin [1 ]
Zhang, Qiuting [2 ]
Hong, Yaoye [1 ]
Yin, Jie [1 ]
机构
[1] North Carolina State Univ, Dept Mech & Aerosp Engn, Raleigh, NC 27695 USA
[2] Yale Univ, Dept Mol Cellular & Dev Biol, New Haven, CT 06520 USA
基金
美国国家科学基金会;
关键词
3D modular kirigami; deformation modes; disassemblable metamaterials; mechanical metamaterials; modular assembly; modular disassembly; programmable properties; MECHANICAL METAMATERIALS; DESIGN; COMPRESSIBILITY;
D O I
10.1002/adfm.202105641
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Kirigami, the ancient paper art of cutting, has recently emerged as a new approach to construct metamaterials with novel properties imparted by cuts. However, most studies are limited to thin sheets-based 2D kirigami metamaterials with specific forms and limited reconfigurability due to planar connection constraints of cut units. Here, 3D modular kirigami is introduced by cutting bulk materials into spatially closed-loop connected cut cubes to construct a new class of 3D kirigami metamaterials. The module is transformable with multiple degrees of freedom that can transform into versatile distinct daughter building blocks. Their conformable assembly creates a wealth of reconfigurable and disassemblable metamaterials with diverse structures and unique properties, including reconfigurable 1D column-like materials, 2D lattice-like metamaterials with phase transition of chirality, as well as 3D frustration-free multilayered metamaterials with 3D auxetic behaviors and programmable deformation modes. This study largely expands the design space of kirigami metamaterials from 2D to 3D.
引用
收藏
页数:10
相关论文
共 50 条
  • [31] Transformable, Freestanding 3D Mesostructures Based on Transient Materials and Mechanical Interlocking
    Park, Yoonseok
    Luan, Haiwen
    Kwon, Kyeongha
    Zhao, Shiwei
    Franklin, Daniel
    Wang, Heling
    Zhao, Hangbo
    Bai, Wubin
    Kim, Jong Uk
    Lu, Wei
    Kim, Jae-Hwan
    Huang, Yonggang
    Zhang, Yihui
    Rogers, John A.
    ADVANCED FUNCTIONAL MATERIALS, 2019, 29 (40)
  • [32] A unified cut topology that endows programmable bistability in modular kirigami morphing structures
    Yin, Yanqi
    Li, Bo
    Hu, Yunzhou
    Yu, Yang
    Zhang, Yupei
    Liu, Xiaofei
    Bai, Ruiyu
    Chen, Guimin
    CELL REPORTS PHYSICAL SCIENCE, 2024, 5 (12):
  • [33] Monolithically Assembled 3D Soft Transformable Robot
    Hwang, Jae Hyuk
    Shin, Jeehae
    Han, Jiseok
    Choi, Yong-Seok
    Park, Sungmin
    Kim, Yun Ho
    Kim, Yong Seok
    Kang, Hong Suk
    Kim, Dong-Gyun
    Lee, Jong-Chan
    ADVANCED INTELLIGENT SYSTEMS, 2022, 4 (09)
  • [34] 3D metamaterials at optical frequencies
    Rho, Junsuk
    Yoon, Gwanho
    Kim, Inki
    Kim, Minkyung
    So, Sunae
    Mun, Jungho
    Jo, Yongjoon
    2017 IEEE 12TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS), 2017,
  • [35] ON THE EFFECTIVE PROPERTIES OF 3D METAMATERIALS
    Abdelhamid, Mohamed
    Czekanski, Aleksander
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 9, 2017,
  • [36] 3D Printed Infrared Metamaterials
    Sharac, N.
    Iyer, G. R. S.
    Tischler, J. G.
    QUANTUM SENSING AND NANO ELECTRONICS AND PHOTONICS XVI, 2019, 10926
  • [37] 3D PRINTING OF ANISOTROPIC METAMATERIALS
    Garcia, C. R.
    Correa, J.
    Espalin, D.
    Barton, J. H.
    Rumpf, R. C.
    Wicker, R.
    Gonzalez, V.
    PROGRESS IN ELECTROMAGNETICS RESEARCH LETTERS, 2012, 34 : 75 - 82
  • [38] 3D Printed Embedded Metamaterials
    Zhang, Kun Peng
    Liao, Yan Fei
    Qiu, Bin
    Zheng, Yue Kun
    Yu, Ling Ke
    He, Gong Han
    Chen, Qin Nan
    Sun, Dao Heng
    SMALL, 2021, 17 (50)
  • [39] 3D Pixel Mechanical Metamaterials
    Pan, Fei
    Li, Yilun
    Li, Zhaoyu
    Yang, Jialing
    Liu, Bin
    Chen, Yuli
    ADVANCED MATERIALS, 2019, 31 (25)
  • [40] A 3D miniaturised programmable transceiver
    O'Flynn, B
    Bellis, S
    Mahmood, K
    Morris, M
    Duffy, G
    Delaney, K
    O'Mathuna, C
    MICROELECTRONICS INTERNATIONAL, 2005, 22 (02) : 8 - 12