A low cost packaging solution for microwave applications

被引：5
|
作者：
Wormald, R. [1 ]
David, S. [1 ]
Panaghiston, G. [2 ]
Jeffries, R. [2 ]
机构：
[1] Filtron, Salts Mill Rd, Shipley BD18 3TT, W Yorkshire, England
[2] BAE SYST Adv Technol Ctr, Chelmsford CM2 8HN, Essex, England
来源：
2006 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE | 2006年
关键词：
liquid crystalline polymer (LCP); packaging;
D O I：
10.1109/EMICC.2006.282788
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Lower cost solutions for packaging GaAs pHEMT devices, MMIC's and Multi Chip Modules (MCM's) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using Liquid Crystal Polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed.
引用
收藏
页码：205 / +
页数：2
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