Getting Small, new 10μm pixel pitch cooled infrared products

被引：11

作者：

Reibel, Y. ^{[1
]}

Pere-Laperne, N. ^{[1
]}

Augey, T. ^{[1
]}

Rubaldo, L. ^{[1
]}

Decaens, G. ^{[1
]}

Bourqui, M. L. ^{[1
]}

Manissadjian, A. ^{[1
]}

Billon-Lanfrey, D. ^{[1
]}

Bisotto, S. ^{[2
]}

Gravrand, O. ^{[2
]}

Destefanis, G. ^{[2
]}

Druart, G. ^{[3
]}

Guerineau, N. ^{[3
]}

机构：

[1] SOFRADIR, 43-47 Rue Camille Pelletan, F-92290 Chatenay Malabry, France

[2] CEA Leti MINATEC, F-38054 Grenoble, France

[3] Off Natl Etud & Rech Aerosp, French Aerosp Lab, F-91761 Palaiseau, France

来源：

INFRARED TECHNOLOGY AND APPLICATIONS XL | 2014年 / 9070卷

关键词：

HgCdTe; Infrared detectors; SWAP; small pixel pitch; 10 mu m pixel pitch; long-range;

D O I：

10.1117/12.2051654

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Recent advances in miniaturization of IR imaging technology have led to a burgeoning market for mini thermal-imaging sensors. Seen in this context our development on smaller pixel pitch has opened the door to very compact products. When this competitive advantage is mixed with smaller coolers, thanks to HOT technology, we achieve valuable reductions in size, weight and power of the overall package. In the same time, we are moving towards a global offer based on digital interfaces that provides our customers lower power consumption and simplification on the IR system design process while freeing up more space. Additionally, we are also investigating new wafer level camera solution taking advantage of the progress in micro-optics. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI and ONERA.

引用

页数：10

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