Grain boundary engineering of copper shaped-charge

被引：0
|
作者：
Blobaum, KJM [1 ]
Stölken, JS [1 ]
Kumar, M [1 ]
机构：
[1] Lawrence Livermore Natl Lab, Livermore, CA 94550 USA
来源：
INTERFACIAL ENGINEERING FOR OPTIMIZED PROPERTIES III | 2004年 / 819卷
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
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页码：51 / 56
页数：6
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