Solid state direct bonding of polymers by vacuum ultraviolet light below 160 nm

被引:9
|
作者
Hashimoto, Yuki [1 ]
Yamamoto, Takatoki [1 ]
机构
[1] Tokyo Inst Technol, Dept Mech Engn, Meguro Ku, 2-12-1 Ookayama, Tokyo 1528550, Japan
基金
日本学术振兴会;
关键词
Vacuum ultraviolet light; Surface activated bonding; Polymer; Heat and adhesive free; CHIP; PDMS; LAB;
D O I
10.1016/j.apsusc.2017.04.032
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This work investigated the application of vacuum ultraviolet (VUV) irradiation to the bonding of various substrates, including glass, polycarbonate (PC), cyclic olefin polymer (COP), polydimethylsiloxane (PDMS) and polymethyl methacrylate (PMMA). This method has the advantage of being able to bond various substrates without the application of heat or adhesives, and therefore may be very useful in the fabrication of micro/nanoscale structures composed of polymers. In contrast to previous applications of this technique, the present study used VUV radiation at wavelengths at and below 160 nm so as to take advantage of the higher energy in this range. Bonding was assessed based on measuring the shear stress of various test specimens subjected to VUV irradiation and then pressed together, and a number of analytical methods were also employed to examine the irradiated surfaces in order to elucidate the morphological and chemical changes following VUV treatment. These analyses included water contact angle measurements, attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR), time of flight secondary ion mass spectrometry (TOF-SIMS) and atomic force microscopy (AFM). Poor bonding was identified between combinations consisting of PMMA/PC, PMMA/COP, PMMA/PMMA, PMMA/glass, and PC/COP, whereas all other combinations resulted in successful bonding with the bonding stress values such as PC/PC = 2.0 MPa, PC/glass = 10.7 MPa and COP/COP = 1.7 MPa, respectively. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码:319 / 327
页数:9
相关论文
共 50 条
  • [41] Recent Progress on AlGaN Based Deep Ultraviolet Light-Emitting Diodes below 250 nm
    Zhang, Chunyue
    Jiang, Ke
    Sun, Xiaojuan
    Li, Dabing
    CRYSTALS, 2022, 12 (12)
  • [42] Solid-state bonding between Al and Cu by vacuum hot pressing
    Lee, Kwang Seok
    Kwon, Yong-Nam
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2013, 23 (02) : 341 - 346
  • [43] Plasma impact on 193 nm photoresist linewidth roughness: Role of plasma vacuum ultraviolet light
    Pargon, E.
    Martin, M.
    Menguelti, K.
    Azarnouche, L.
    Foucher, J.
    Joubert, O.
    APPLIED PHYSICS LETTERS, 2009, 94 (10)
  • [44] Photolysis of Indigo Carmine solution by planar vacuum-ultraviolet (147 nm) light source
    Zukawa, Takehiro
    Sasaki, Yoshiki
    Kurosawa, Takako
    Kamiko, Naoyuki
    CHEMOSPHERE, 2019, 214 : 123 - 129
  • [45] Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
    Endo, S.
    Shimizu, A.
    Fukada, K.
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2024, 13 (02)
  • [46] PRIMATE PULPAL RESPONSE TO ULTRAVIOLET LIGHT POLYMERIZED DIRECT-BONDING MATERIAL SYSTEMS
    MYERS, CL
    STANLEY, HR
    HEYDE, JB
    CHAMBERLAIN, J
    JOURNAL OF DENTAL RESEARCH, 1976, 55 (06) : 1118 - 1124
  • [47] PRODUCTION AND DIRECT MEASUREMENT OF CIRCULARLY POLARIZED VACUUM-ULTRAVIOLET LIGHT WITH MULTIREFLECTION OPTICS
    KOIDE, T
    SHIDARA, T
    YURI, M
    KANDAKA, N
    FUKUTANI, H
    APPLIED PHYSICS LETTERS, 1991, 58 (23) : 2592 - 2594
  • [48] DAMAGE OF CELL-SURFACE BY VACUUM ULTRAVIOLET-RADIATION - EXPERIMENTS WITH 160 NM SYNCHROTRON RADIATION AND 163 NM RADIATION FROM BROMINE DISCHARGE LAMP
    ITO, T
    ITO, A
    KOBAYASHI, K
    HIEDA, K
    JOURNAL OF RADIATION RESEARCH, 1984, 25 (01) : 48 - 48
  • [49] ULTRAVIOLET LIGHT INDUCED FREE RADICALS IN GLYCINE PEPTIDES IN SOLID STATE
    COLLINS, MA
    GRANT, RA
    PHOTOCHEMISTRY AND PHOTOBIOLOGY, 1969, 9 (04) : 369 - &
  • [50] SOLID-STATE BONDING OF LOW-CARBON STEEL BELOW ACL TRANSFORMATION TEMPERATURE
    NOGAMI, A
    TETSU TO HAGANE-JOURNAL OF THE IRON AND STEEL INSTITUTE OF JAPAN, 1986, 72 (13): : 1609 - 1609