annealing;
charge;
gate dielectric;
HfO2;
high-kappa;
metal gate electrode;
work function;
D O I:
10.1109/LED.2004.840016
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
This letter presents a systematic investigation of charge in HfO2 gate stacks. Assuming that the majority of charge is associated with the stack interfaces, it is found that the charge at the HfO2/interfacial layer (IL) interface is negative while the charge at the SOL interface is positive. In general, the calculated charge densities at both interfaces are of order 10(12) cm(-2). A forming gas anneal (FGA) reduces the interface charge greatly at both interfaces. However, the FGA temperature does not have much effect on the charge density. The effects of post deposition anneal at various temperatures and under various atmospheres are also studied. Its found that a high temperature dilute oxidizing atmosphere anneal reduces the charge at both interfaces.
机构:
Liverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, EnglandLiverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, England
Zhao, C. Z.
Zhang, J. F.
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机构:Liverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, England
Zhang, J. F.
Zahid, M. B.
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机构:Liverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, England
Zahid, M. B.
Groeseneken, G.
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机构:Liverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, England
Groeseneken, G.
Degraeve, R.
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机构:Liverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, England
Degraeve, R.
De Gendt, S.
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机构:Liverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, England