Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

被引：9
|
作者：
Fang, Hui [1 ]
Wang, Chenxi [1 ]
Wang, Te [1 ]
Wang, Hong [2 ]
Zhou, Shicheng [1 ]
Huang, Yilong [1 ]
Tian, Yanhong [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China
[2] Acad Space Elect Informat Technol, Xian 710100, Shaanxi, Peoples R China
来源：
MATERIALS LETTERS | 2019年 / 256卷
基金：
中国国家自然科学基金; 中国博士后科学基金;
关键词：
Nanoparticles; Sintering; Plasma activation; Low-temperature bonding; Thermal conductivity; Shear strength;
D O I：
10.1016/j.matlet.2019.126620
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A controllable plasma-activated method to achieve pressureless sintering of Ag nanoparticles is proposed for low-temperature bonding. O-2 plasma activation is employed to effectively decompose organics coated on the nanoparticles prior to sintering, avoiding the loose interfacial microstructures. Therefore, robust bonding Cu-Cu joints with high shear strength (>20 MPa) can be formed at a low temperature of 200 degrees C without requiring additional pressure. This rapid and controllable activation method significantly enhances the sinterability of the Ag particles, leading to a dense microstructure. The improved thermal conductivity is three times higher than the one prepared without plasma activation. (C) 2019 Elsevier B.V. All rights reserved.
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页数：4
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