Wireless Power Distribution Network for 3D Package Using Magnetic Field Resonance

被引：0

作者：

Song, Eunseok ^{[1
]}

Kim, Hongseok ^{[1
]}

Song, Chiuk ^{[1
]}

Kim, Jonghoon J. ^{[1
]}

Kim, Joungho ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Elect Engn, Terahertz Interconnect & Package Lab, Taejon, South Korea

来源：

2013 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) | 2013年

关键词：

wireless power transfer (WPT); power distribution network (PDN); 3D package; magnetic field; resonance; inductor design; PDN-impedance; power efficiency; simultaneous switching noise (SSN);

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a wireless power transfer (WPT) scheme using magnetic field resonances for 3D packages is proposed and a wireless power distribution network (PDN) in a WPT system is analyzed in terms of the simultaneous switching noise (SSN). For analyzing the wireless PDN impedance characteristic and the power efficiency, a ball grid array (BGA) package with a size of 35 mmx35 mm is fabricated. Also, a new schematic of the wire PDN is defined to analyze a WPT system applied to the WPT system in terms of SSN. The impedance (Z(11)) characteristics between the interconnection-based hierarchical PDN structure and the hierarchical PDN based on the proposed WPT scheme are compared and analyzed. The package-level WPT system proposed in this study represents excellent wireless PDN impedance characteristics in decreasing the power noise occurred in a 3D package.

引用

页码：32 / 35

页数：4

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