Effect of thermal contact conductance on the solidification of a Pb-Sn solder alloy

被引：0
|
作者：
Prabhu, KN [1 ]
Kumar, ST [1 ]
Venkataraman, N [1 ]
机构：
[1] Natl Inst Technol, Dept Met & Mat Engn, Srinivasnagar 575025, Karnataka, India
来源：
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS | 2002年 / 55卷 / 06期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
During soldering, the solder/substrate thermal contact conductance must be high enough to prevent the separation of the solidified shelf from the substrate. In the present work, the effect of thermal contact conductance on temperature distribution inside a 60Sn-40Pb solder alloy solidifying against metallic chills was simulated. The results of the simulation indicated that the thermal contact conductance plays a major role during solidification in the solder/substrate interfacial region of the casting particularly when the substrate material has a high thermal conductivity. The influence of solder/chill contact conductance on solidification decreased with increase in the distance from the solder/chill interface.
引用
收藏
页码：565 / 568
页数：4
相关论文
共 50 条
  • [31] Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions
    Zuruzi, AS
    Chiu, CH
    Lahiri, SK
    Chua, KM
    JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) : 1224 - 1230
  • [32] Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions
    A. S. Zuruzi
    C. -H. Chiu
    S. K. Lahiri
    K. M. Chua
    Journal of Electronic Materials, 1999, 28 : 1224 - 1230
  • [33] Effect of lead content on vibration fracture behavior of Pb-Sn eutectic solder
    Chuang, CM
    Lui, TS
    Chen, LH
    JOURNAL OF MATERIALS RESEARCH, 2001, 16 (09) : 2644 - 2652
  • [34] Solidification of Pb-Sn alloys under ultrasonic field
    Haghayeghi, R.
    Kapranos, P.
    MATERIALS LETTERS, 2014, 126 : 244 - 248
  • [35] VISCOSITY MEASUREMENT OF PB-SN BINARY MELTS AND THE EFFECT OF MELTING AND SOLIDIFICATION ON THE MEASUREMENT
    EJIMA, T
    SATO, Y
    YAMAMURA, T
    HAYASHI, A
    YAMAZAKI, T
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1990, 54 (09) : 1005 - 1012
  • [36] SOLIDIFICATION AND MICROSTRUCTURE OF EUTECTIC PB-SN MICROSOLDER BONDS
    GREEN, NR
    CHARLES, JA
    SMITH, GC
    MATERIALS SCIENCE AND TECHNOLOGY, 1994, 10 (11) : 977 - 980
  • [37] CHARACTERISTICS OF RAPID SOLIDIFIED PB-SN ALLOY WIRES AND THEIR APPLICATION TO SOLDER BUMP FOR FINE JUNCTION
    OGASHIWA, T
    INOUE, A
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1994, 58 (08) : 944 - 951
  • [38] INTERDENDRITIC FLUID FLOW IN A PB-SN ALLOY
    KAEMPFFER, F
    WEINBERG, F
    METALLURGICAL TRANSACTIONS, 1971, 2 (11): : 3051 - +
  • [39] Changes in the electric conductance of sliding contacts under occurrence of a Pb-Sn melt in the contact space
    Fadin, V. V.
    Aleutdinova, M. I.
    RUSSIAN PHYSICS JOURNAL, 2013, 55 (09) : 1028 - 1033
  • [40] Peculiarities of discontinuous precipitation in the Pb-Sn alloy
    Lyashenko, Yu.A.
    Zaitzeva, N.V.
    Shmatko, O.A.
    2007, Trans Tech Publications Ltd (261-262)
12345