Growth and characterisation of hard and elastic carbon nitride thin films

被引:19
|
作者
Kolitsch, A
Möller, W
Malkow, T
Bull, SJ
Magula, V
Domankova, M
机构
[1] Forschungszentrum Rossendorf EV, Inst Ion Beam Phys & Mat Res, D-01314 Dresden, Germany
[2] Newcastle Univ, Div Mat, Dept Mech Mat & Mfg Engn, Newcastle Upon Tyne NE1 7RU, Tyne & Wear, England
[3] Welding Res Inst, Div Phys Met, Bratislava 83259, Slovakia
来源
关键词
IBAD; hard coatings; XPS; EELS; nanoindentation;
D O I
10.1016/S0257-8972(00)00590-9
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Hard CN, films were prepared by nitrogen ion beam-assisted deposition (IBAD) of evaporated carbon on silicon wafers with a nitrogen ion energy of 100-1200 eV, ion/neutral transport ratios from 0.7 to 1.7, and deposition temperatures from RT to 1000 degrees C. By varying the deposition parameters a maximum nitrogen content of below 33 at.% was found at N/C transport ratios of approximately 1.2. XPS measurements reflect a shift of the main chemical state of the nitrogen bonds with changing nitrogen content of the films and with increasing deposition temperature. The nitrogen content of the films decreases significantly with increasing temperatures above 600 degrees C. EELS investigations show weak changes of the plasmon peak position and the sp(2)/sp(3) ratio with increasing deposition temperature in correlation to the nitrogen content of the carbon films. Nanoindentation techniques have been used to investigate the mechanical properties of the films. All measured structural and mechanical properties correlate with the analysed nitrogen content. (C) 2000 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:126 / 132
页数:7
相关论文
共 50 条
  • [41] Carbon nitride (CNx) films formed by ion implantation into thin carbon films
    Husein, IF
    Zhou, YZ
    Chan, C
    Kleiman, JI
    Gudimenko, Y
    Leung, KN
    ION-SOLID INTERACTIONS FOR MATERIALS MODIFICATION AND PROCESSING, 1996, 396 : 255 - 260
  • [42] Preparation of boron nitride thin films by microwave PECVD and their analytical characterisation
    Thamm, T
    Baumann, W
    Dietrich, D
    Meyer, N
    Stöckel, S
    Marx, G
    PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2001, 3 (23) : 5150 - 5153
  • [43] Thermomechanical properties of the amorphous carbon nitride thin films
    Champi, A
    Lacerda, RG
    Marques, FC
    MICROELECTRONICS JOURNAL, 2003, 34 (5-8) : 553 - 555
  • [44] Characterisation of defects in thin films of hydrogenated amorphous carbon
    Collins, M
    Barklie, RC
    Anguita, JV
    Carey, JD
    Silva, SRP
    DIAMOND AND RELATED MATERIALS, 2000, 9 (3-6) : 781 - 785
  • [45] Structure of amorphous carbon-nitride thin films
    Radnóczi, G
    Kovács, I
    Geszti, O
    Bíró, LP
    Sáfrán, G
    SURFACE & COATINGS TECHNOLOGY, 2002, 151 : 133 - 137
  • [46] What happens in the annealing of carbon nitride thin films?
    Xu, WT
    Fujimoto, T
    Wang, L
    Ohchi, T
    Kojima, I
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (01): : 6 - 11
  • [47] Semiconducting amorphous camphoric carbon nitride thin films
    Rusop, M
    Soga, T
    Jimbo, T
    Umeno, A
    Sharon, M
    SURFACE REVIEW AND LETTERS, 2005, 12 (04) : 587 - 595
  • [48] Ion beam processing of carbon nitride thin films
    Wu, RLC
    Lanter, WC
    Wrbranek, J
    Kosel, PB
    Dejoseph, CA
    FUNDAMENTAL MECHANISMS OF LOW-ENERGY-BEAM-MODIFIED SURFACE GROWTH AND PROCESSING, 2000, 585 : 245 - 250
  • [49] Adhesion of carbon nitride thin films on tool steel
    Chowdhury, AKMS
    Cameron, DC
    Hashmi, MSJ
    SURFACE & COATINGS TECHNOLOGY, 1999, 116 : 46 - 53
  • [50] Graphitic carbon nitride thin films deposited by electrodeposition
    Li, C
    Cao, CB
    Zhu, HS
    MATERIALS LETTERS, 2004, 58 (12-13) : 1903 - 1906