Sacrificial layer for laser lift-off process for flexible-display production

In this study, we developed a new sacrificial layer (SL) for laser transfer process. Metallic substrate i.e. invar foil was temporarily docked to a glass substrate using glass powder. To ensure successful delamination, the SL was pre-deposited between metal foil and glass substrate. For the first time, the SLs were amorphous gallium nitride and non-stoichiometric gallium oxide which were implemented for laser lift off (LLO) processes of metal foil. Bonding of metal foil to glass sheet was performed using heat treatment while debonding was achieved by LLO method. The laser wavelength was 355 nm which was the best fit for full absorption from SL layers. Transmission electron microscopy, element mapping, and energy dispersive X-ray spectroscopy analyses were performed for investigating elements' migration and bonding-debonding mechanism.