Thermal Design Strategy of Server and Storage Products for 1U and 2U System

被引：0
|
作者：
Chang, Brant [1 ]
Hsiao, Clay [1 ]
Hung, Ping-Chi [1 ]
Wang, C. T. [1 ]
机构：
[1] Univ Sci Ind Co Ltd, CAE Design Dept, Tsaotuen, Nan Tou, Taiwan
来源：
IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE | 2009年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
There are four topics have been discussed in this paper via numerical simulation which include on board placement, stand-off, redundancy design and outlet condition. The simulation is performed for 1U with 200W and 2U system with 700W, respectively. This paper also provides the some solutions for each topic and reveals the thermal phenomena in these two systems. The proper placement can reduce the loading of thermal design, and it will make the design easier. The effect of stand-off is important in 1U system and will limited to the thermal performance of CPU cooler. For redundancy design, the flow field may be complex due to re-flow. The outlet condition will also affect the thermal performance, the other possible solutions have been mentioned in this paper.
引用
收藏
页码：505 / 508
页数：4
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