A new method of optical interconnection for multiply stacked planar optical circuit boards using 45° reflection coupling

被引：1
|
作者：
Lee, Hyun-Shik [1 ]
An, Shinmo [1 ]
Lee, El-Hnag [1 ]
机构：
[1] Inha Univ, Sch Informat & Commun Engn, OPERA, Inchon 402751, South Korea
来源：
MICROELECTRONIC ENGINEERING | 2010年 / 87卷 / 5-8期
关键词：
Micro-imprinting; Polymer optical waveguide; Optical via; WAVE-GUIDES; FABRICATION;
D O I：
10.1016/j.mee.2009.12.040
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We developed, for the first time to our knowledge, a new method of providing optical interconnection for multiply stacked planar optical waveguide boards, using 45 degrees reflection coupling. This consists of two 45 degrees reflection mirrors vertically stacked and facing each other. We developed special molds that can imprint rectangular polymer waveguides and 45 degrees reflection mirrors simultaneously. This opens up new ways of optically integrating multiple stacks of optical wire circuit boards for high-density photonic circuit integration application. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码：1336 / 1339
页数：4
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