Silicon damage studies due to ultra-low-energy ion implantation with heavy species and rapid thermal annealing

被引:7
|
作者
Moffatt, S
Hemment, PLF
Whelan, S
Armour, DG
机构
[1] Appl Mat Inc, Santa Clara, CA 95054 USA
[2] Univ Surrey, Guildford GU2 5XH, Surrey, England
[3] Univ Salford, Salford M5 4WT, Lancs, England
关键词
silicon damage; ion implantation; heavy ion species; rapid thermal annealing;
D O I
10.1016/S1369-8001(00)00046-9
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
There have been many studies of electron volt implants of B+ into silicon. This focus on boron was due to enhanced diffusion phenomena and the particular difficulty in constructing high conductivity, very shallow layers with B+ light ion. We have also analysed some features of high-dose implantation of As+ to form n(+) layers with shallow junction depths (30-40 nm) with carrier concentration of > IE20 cm(-3). Some of our heavy ion work is presented here. We characterised the surface damage region (SDR) and identified several non-linear phenomena. High-conductivity layers of 150-300 Omega /square can be made with rapid thermal annealing, The critical limiting factors are range shortening, sputtering and out-diffusion, The range shortening is evident in the saturation behaviour and the out-diffusion is seen as a build up of non-substitutional arsenic in the oxide or the oxide-silicon interface after annealing. We have used Rutherford backscattering (RBS), medium-energy ion scattering (MEIS) and high-resolution transmission electron microscopy (HRTEM) to study crystal micro-structure and damage, as well as secondary ion mass spectrometry (SIMS), spreading resistance profiling (SRP) and sheet resistance methods to study both the diffusion and activation of the dopant. We have observed new features in the diffusion profile with various implant temperatures and offer some explanations for this behaviour. We have also studied Sb+ and In+ implants because they are becoming increasingly important, at moderate energies, for hyper-abrupt channel and channel engineering with controlled lateral diffusion. Models have been developed to describe the non-linear behaviour of heavy ion doping at low energies and our results demonstrate that implants in the energy range 300 eV-2.5 keV can provide solutions when combined with short rapid thermal anneals for the manufacture of very shallow junctions with high activation of dopant. Interestingly, implants at room temperature do not produce the best results. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:291 / 296
页数:6
相关论文
共 50 条
  • [31] Anomalous uphill diffusion and dose loss of ultra-low-energy implanted boron in silicon during early stage of annealing
    Tsuji, H
    Furuhashi, M
    Tachi, M
    Taniguchi, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2004, 43 (03): : 873 - 876
  • [32] Implantation damage effect on boron annealing behavior using low-energy polyatomic ion implantation
    Jin, JY
    Liu, JR
    van der Heide, PAW
    Chu, WK
    APPLIED PHYSICS LETTERS, 2000, 76 (05) : 574 - 576
  • [33] Damage, defects and diffusion from ultra-low energy (0-5 keV) ion implantation of silicon
    Agarwal, A
    Gossmann, HJ
    Eaglesham, DJ
    Pelaz, L
    Herner, SB
    Jacobson, DC
    Haynes, TE
    Simonton, R
    SOLID-STATE ELECTRONICS, 1998, 42 (05) : A17 - A25
  • [34] GAAS/ALGAAS QUANTUM WELL MIXING USING LOW-ENERGY ION-IMPLANTATION AND RAPID THERMAL ANNEALING
    ELMAN, B
    KOTELES, ES
    MELMAN, P
    ARMIENTO, CA
    ADVANCES IN MATERIALS, PROCESSING AND DEVICES IN III-V COMPOUND SEMICONDUCTORS, 1989, 144 : 445 - 449
  • [35] The synthesis of single layers of Ag nanocrystals by ultra-low-energy ion implantation for large-scale plasmonic structures
    Carles, R.
    Farcau, C.
    Bonafos, C.
    Benassayag, G.
    Pecassou, B.
    Zwick, A.
    NANOTECHNOLOGY, 2009, 20 (35)
  • [36] Medium energy ion scattering analysis of damage in silicon caused by ultra-low energy boron implantation at different substrate temperatures
    Zhang, SJ
    van den Berg, JA
    Armour, DG
    Whelan, S
    Goldberg, RD
    Bailey, P
    Noakes, TCQ
    2000 INTERNATIONAL CONFERENCE ON ION IMPLANTATION TECHNOLOGY, PROCEEDINGS, 2000, : 119 - 122
  • [37] The residual electrically active damage in low energy boron implanted silicon: rapid thermal annealing and implant mass effects
    Kaabi, L
    Ben Brahim, J
    Remaki, B
    Gontrand, C
    El Omari, H
    Bureau, JC
    Sassi, Z
    Balland, B
    EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 1998, 3 (01): : 49 - 52
  • [38] Raman and SIMS studies of rapid thermal annealing effect of silicon ion implanted GaAs
    Dilawar, N
    Varandani, D
    Chakraborty, BR
    Bandyopadhyay, AK
    JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 2000, 61 (12) : 1927 - 1933
  • [39] AlN films obtained by a broad energy nitrogen ion implantation and rapid thermal annealing process
    Grigorov, KG
    Nedkov, I
    Beshkov, G
    Angelov, C
    Maciel, HS
    Matz, W
    Groetzchel, R
    Velchev, N
    JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2005, 7 (01): : 381 - 384
  • [40] Formation of Si/SiC multilayers by low-energy ion implantation and thermal annealing
    Dobrovolskiy, S.
    Yakshin, A. E.
    Tichelaar, F. D.
    Verhoeven, J.
    Louis, E.
    Bijkerk, F.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2010, 268 (06): : 560 - 567