Hygro-thermo-mechanical behavior of molding compounds at elevated environments

被引：0
|
作者：
Yi, S [1 ]
Yu, ZY [1 ]
Neo, R [1 ]
Lee, YJ [1 ]
机构：
[1] Portland State Univ, Dept Mech Engn, Portland, OR 97207 USA
来源：
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年
关键词：
D O I：
10.1109/ECTC.2004.1319334
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, the time, temperature and moisture dependent properties of polymer molding compounds used for plastic IC packages are investigated experimentally. The moisture absorption in the molding compound is determined at various environmental conditions. The creep behaviors of molding compounds are measured at various temperatures below the glass transition and at various humidity conditions. The experimental results show that moisture content and temperature significantly affect the mechanical behavior of the material. The increase of moisture content results in increasing the magnitudes of strains remarkably. The time function of its compliance is also characterized and the shift function is evaluated.
引用
收藏
页码：180 / 185
页数：6
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