Chiplet Micro-Assembly Printer

被引：8

作者：

Rupp, Bradley B. ^{[1
]}

Plochowietz, Anne ^{[1
]}

Crawford, Lara S. ^{[1
]}

Shreve, Matthew ^{[1
]}

Raychaudhuri, Sourobh ^{[1
]}

Butylkov, Sergey ^{[1
]}

Wang, Yunda ^{[1
]}

Mei, Ping ^{[1
]}

Wang, Qian ^{[1
]}

Kalb, Jamie ^{[1
]}

Wang, Yu ^{[1
]}

Chow, Eugene M. ^{[1
]}

Lu, Jeng Ping ^{[1
]}

机构：

[1] PARC, 3333 Coyote Hill Rd, Palo Alto, CA 94304 USA

来源：

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2019年

关键词：

assembly; printed electronics; chiplets; transfer; heterogeneous integration; flexible electronics; microLED;

D O I：

10.1109/ECTC.2019.00203

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A deterministic, directed, parallel electrostatic assembly and transfer process is being developed to arrange chips for electronics applications. Singulated chips 10 um - 200 um in size and initially in solution, are sorted, transported and oriented to form programmed patterns. The arrangements are then transferred to a final substrate with contact stamping or an electrostatic roller belt. Demonstrations achieved include automated parallel assembly, micrometer scale registration, heterogeneous integration, inch scale outputs, and basic functional circuits. The eventual goal is the ability to integrate millions of chiplets into systems with fine control over large areas to enable next generation electronic systems.

引用

页码：1312 / 1315

页数：4

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