It is shown that in low-temperature plasma devices with pulsed external current circuits such as thermal emission converters and plasma diodes, the only forces inducing plasma flows are due to the temperature stresses on ions. These flows are similar to the plasma "residual" rotations in tokamaks. However, they are connected with the perpendicular viscosity dependence of the ion heat fluxes, contrary to tokamaks where parallel viscosity plays the main role. Dust contamination of these devices can induce temperature-gradient driven flows of ions, which also entrain neutrals in a multi-component partially ionized plasma. (C) 1998 Elsevier Science B.V.