Transient and residual stresses in a hollow cylinder of functionally graded materials

被引:2
|
作者
Chen, CH [1 ]
Awaji, H [1 ]
机构
[1] Nagoya Inst Technol, Dept Mat Sci & Engn, Nagoya, Aichi 466, Japan
来源
关键词
thermal stress; residual stress; thermal shock;
D O I
10.4028/www.scientific.net/MSF.423-425.665
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
One-dimensional transient and residual stress fields in a hollow cylinder of functionally graded materials (FGMs) for two models of ceramic-metal systems are studied subjected to severe thermal shock. It is clear that residual stresses in FGMs arise primarily from spatial variations in the thermal expansion coefficient, but can be significantly modulated by the Young's modulus gradient. Analytical results of the thermal stress required to reduce the transient stress and residual stress in the FGM provide a means of appropriate microstructure design for FGMs to select FGM constituents and spatial variation in material properties.
引用
收藏
页码:665 / 669
页数:5
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