A Static, Switching, Short-circuit Characteristics of 1.2 kV 4H-SiC MOSFETs: Comparison between Linear and (Bridged) Hexagonal Topology

被引:2
|
作者
Kim, Dongyoung [1 ]
Yun, Nick [1 ]
DeBoer, Skylar [1 ]
Morgan, Adam J. [1 ]
Jang, Seung Yup [1 ]
Sung, Woongje [1 ]
Fan, Junchong [2 ]
Yu, Susanna [2 ]
Kang, Minseok [2 ]
Agarwal, Anant K. [2 ]
机构
[1] State Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA
[2] Ohio State Univ, Dept Elect & Comp Engn, Columbus, OH 43210 USA
关键词
Short-circuit ruggedness; Topology; Hexagonal; Linear; Switching; 4H-SiC; MOSFETs; SIC MOSFET;
D O I
10.1109/WiPDA49284.2021.9645098
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports the layout approaches and resulting static, dynamic, and short-circuit (SC) ruggedness characteristics of 1.2 kV power MOSFETs fabricated on a 6-inch 4H-SiC substrate. Different layout topologies (linear and hexagonal) and different design variations (with and without bridge of P-well) were investigated to study their effect. It was experimentally demonstrated that 1) the hexagonal layout topology enables a low specific on-resistance (R-on.sp), 2) the linear MOSFET can be utilized in high frequency applications due to fast switching speed, and 3) the hexagonal topology with bridge offers greater reliability and ruggedness.
引用
收藏
页码:9 / 13
页数:5
相关论文
共 50 条
  • [21] A study on turn-off, and on-resistance and short-circuit capability trade-off characteristics in 1.2 kV SiC MOSFETs
    Suzuki, Kazuhiro
    Yano, Hiroshi
    Iwamuro, Noriyuki
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2024, 63 (12):
  • [22] 4H-SiC/SiO2 Interface Degradation in 1.2 kV 4H-SiC MOSFETs Due to Power Cycling Tests
    Yoo, Dahui
    Kim, Mijin
    Kang, Inho
    Lee, Ho-Jun
    ELECTRONICS, 2024, 13 (07)
  • [23] Low On-Resistance 1.2 kV 4H-SiC MOSFETs Integrated with Current Sensor
    Furukawa, A.
    Kinouchi, S.
    Nakatake, H.
    Ebiike, Y.
    Kagawa, Y.
    Miura, N.
    Nakao, Y.
    Imaizumi, M.
    Sumitani, H.
    Oomori, T.
    2011 IEEE 23RD INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2011, : 288 - 291
  • [24] Influence of P+ Body on Performance and Ruggedness of 1.2 kV 4H-SiC MOSFETs
    Kim, Dongyoung
    Jang, Seung Yup
    Morgan, Adam J.
    Sung, Woongje
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (12) : 7659 - 7665
  • [25] An Inclusive Structural Analysis on the Design of 1.2kV 4H-SiC Planar MOSFETs
    Kim, Dongyoung
    Yun, Nick
    Jang, Seung Yup
    Morgan, Adam J.
    Sung, Woongje
    IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2021, 9 (09): : 804 - 812
  • [26] Gate Oxide Reliability Studies of Commercial 1.2 kV 4H-SiC Power MOSFETs
    Liu, Tianshi
    Zhu, Shengnan
    Yu, Susanna
    Xing, Diang
    Salemi, Arash
    Kang, Minseok
    Booth, Kristen
    White, Marvin H.
    Agarwal, Anant K.
    2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2020,
  • [27] A Deep Insight Into the Degradation of 1.2-kV 4H-SiC MOSFETs Under Repetitive Unclamped Inductive Switching Stresses
    Zhou, Xintian
    Su, Hongyuan
    Yue, Ruifeng
    Dai, Gang
    Li, Juntao
    Wang, Yan
    Yu, Zhiping
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2018, 33 (06) : 5251 - 5261
  • [28] Improved Short-Circuit Ruggedness for 1.2kV 4H-SiC MOSFET Using a Deep P-Well Implemented by Channeling Implantation
    Kim, Dongyoung
    Sung, Woongje
    IEEE ELECTRON DEVICE LETTERS, 2021, 42 (12) : 1822 - 1825
  • [29] Analysis of Static and Dynamic Characteristics of 1.2 kV 4H-SiC Trench MOSFETs with Trenched P-Source and Buried P+ Layers
    Kang, Gyuhyeok
    Park, Yeongeun
    Seok, Ogyun
    JOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY, 2025, 20 (02) : 1059 - 1066
  • [30] Failure and Degradation Analysis of Commercial 1.2-kV SiC Trench MOSFETs Under Repetitive Short-Circuit Stress
    Yu, Hengyu
    Jin, Michael
    Shi, Limeng
    Bhattacharya, Monikuntala
    Qian, Jiashu
    Houshmand, Shiva
    Shimbori, Atsushi
    Agarwal, Anant K.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2025, 72 (04) : 1878 - 1884