Effect of gas pressure on residual stresses in AlN films deposited on Al substrates

被引:0
|
作者
Tian, J
Xue, X
Hanabusa, T
Kusaka, K
机构
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
[2] Univ Tokushima, Fac Engn, Tokushima, Japan
来源
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2003年 / 13卷
关键词
AlN thin film; residual stress; sputtering; gas pressure;
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
AlN Films were prepared on Al alloy substrates by cathode sputtering. The surface morphology of AIN films was studied by atomic force microscopy (AFM), the effect of gas pressure on crystal orientation and residual stress in AIN films was investigated by X-ray diffraction. The AFM images show that many nucleated AIN islands appear to be randomly distributed on the Al surface and are fairly round in shape. The X-ray diffraction(XRD) show that the AIN films have a selective orientation in the normal of the substrate and have good selective orientation deposited at low gas pressure. Compressive residual stress are found in films and increases as gas pressure decreases.
引用
收藏
页码:202 / 205
页数:4
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