Diamond composites of high thermal conductivity and low dielectric loss tangent

被引：8
|
作者：
Osipov, A. S. [1 ]
Klimczyk, P. [2 ]
Rutkowski, P. [3 ]
Melniychuk, Y. A. [1 ]
Romanko, L. O. [1 ]
Podsiadlo, M. [2 ]
Petrusha, I. A. [1 ]
Jaworska, L. [3 ]
机构：
[1] Natl Acad Sci Ukraine, Inst Superhard Mat, 2 Avtozavodskya St, UA-04074 Kiev, Ukraine
[2] Krakow Inst Technol, Lukasiewicz Res Network, Zakopianska 73, PL-30418 Krakow, Poland
[3] AGH Univ Sci & Technol, 30 Al Mickiewicza, PL-30059 Krakow, Poland
来源：
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2021年 / 269卷
关键词：
Diamond composite; High pressure; Thermal conductivity; Dielectric constant; Dielectric loss tangent; CVD DIAMOND; PRESSURE;
D O I：
10.1016/j.mseb.2021.115171
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Diamond-CaMg(CO3)(2) and diamond-CaCO3 compacts were produced. Maximum values of high thermal conductivity of 540 W/m K, electrical resistivity of 2.10(11) ohm cm, dielectric constant of 47, and dielectric loss tangent of 5.8.10(-3) at 106 Hz were achieved. The composites based on diamonds were sintered at a high pressure of 8.0 GPa and temperature of 2100 degrees C and were characterised by high ratios of direct bonding between the diamond grains. Diamond grain size varied from 12 to 45 mu m. The CaCO3 content of the diamond-CaCO3 composites and the CaMg(CO3)(2) content of the diamond-CaMg(CO3) (2) composites were 8.5 vol% and 8.8 vol%, respectively. The materials developed are recommended for use as heat sinks in a wide range of electronic devices.
引用
收藏
页数：5
相关论文
共 50 条
  • [41] High thermal conductivity in indium-based metal/diamond composites by good wettability of diamond with indium
    Zeng, Chengzong
    Shen, Jun
    Zhang, Jianbo
    DIAMOND AND RELATED MATERIALS, 2021, 112
  • [42] Hydroxy silicone oil modified boron nitride for high thermal conductivity and low dielectric loss silicone rubber composites: experimental and molecular simulation studies
    Yu, Xiao
    Qiao, Bo
    Cai, Fei
    Xiao, Ji-hai
    Yang, Wei
    Wu, Si-zhu
    RSC ADVANCES, 2023, 13 (16) : 11182 - 11191
  • [43] Low dielectric permittivity and high thermal conductivity silicone rubber composites with micro-nano-sized particles
    Zha, Jun-Wei
    Zhu, Yan-Hui
    Li, Wei-Kang
    Bai, Jinbo
    Dang, Zhi-Min
    APPLIED PHYSICS LETTERS, 2012, 101 (06)
  • [44] Fabrication of high-thermal-conductivity and low-dielectric boron Nitride/Quartz Fiber/Epoxy composites
    Zhao, Kunlun
    Liu, Yuwei
    Huang, Ruoyu
    Guo, Xing
    Lin, Mingyuan
    Zhao, Dafang
    Zhang, Xue-ao
    MATERIALS LETTERS, 2025, 388
  • [45] On the thermal conductivity of Cu-Zr/diamond composites
    Chu, Ke
    Jia, Chengchang
    Guo, Hong
    Li, Wensheng
    MATERIALS & DESIGN, 2013, 45 : 36 - 42
  • [46] Measurement of the dielectric loss tangent
    Mitrofanov, GA
    Strel'nikov, MY
    INDUSTRIAL LABORATORY, 1997, 63 (12): : 746 - 748
  • [47] High Thermal Conductivity Epoxy/BN Composites with Sufficient Dielectric Breakdown Strength
    Tanaka, Toshikatsu
    Wang, Zengbin
    Iizuka, Tomonori
    Kozako, Masahiro
    Ohki, Yoshimichi
    2011 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, VOLS 1 AND 2, 2011, : 691 - 694
  • [48] Hot-pressing sintered AIN-BN ceramics with high thermal conductivity and low dielectric loss
    Yang, Pei
    Wang, Lixiang
    Zhao, Weihua
    Cai, Laixin
    Feng, Yongbao
    CERAMICS INTERNATIONAL, 2020, 46 (06) : 8431 - 8437
  • [49] Polyvinylidene fluoride/vanadium pentoxide composites with high dielectric constant and low dielectric loss
    Quan, Hongying
    Chen, Dezhi
    Xie, Xiaolin
    Fan, Hongqing
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2013, 210 (12): : 2706 - 2709
  • [50] Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions
    Susumu Arai
    Miyoka Ueda
    Journal of Applied Electrochemistry, 2020, 50 : 631 - 638
12345