Hybrid III-V Lasers on Silicon

被引:0
|
作者
Olivier, S. [1 ]
Malhouitre, S. [1 ]
Kopp, C. [1 ]
Ben Bakir, B. [1 ]
Descos, A. [1 ]
Bordel, D. [1 ]
Menezo, S. [1 ]
Fedeli, J. -M. [1 ]
Duan, G. -H. [2 ]
Kaspar, P. [2 ]
Jany, C. [2 ]
Le liepvre, A. [2 ]
Accard, A. [2 ]
Make, D. [2 ]
Girard, N. [2 ]
Levaufre, G. [2 ]
Shen, A. [2 ]
Charbonnier, P. [2 ]
Mallecot, F. [2 ]
Lelarge, F. [2 ]
Gentner, J. -L. [2 ]
机构
[1] CEA Grenoble, Leti, F-38054 Grenoble, France
[2] III V Lab, Palaiseau, France
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We used the molecular wafer bonding technique to develop a hybrid widely tunable, monomode IIIV/Si laser for wavelength division multiplexing, with a tunability over 35 nm and an output power in excess of 3 mW.
引用
收藏
页码:256 / 257
页数:2
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