Solvothermal approach for low temperature deposition of aluminium oxide thin films

被引:6
|
作者
Duan, XiaoFei [1 ]
Tran, Nguyen H. [2 ]
Roberts, Nicholas K. [3 ]
Lamb, Robert N. [1 ,4 ]
机构
[1] Univ Melbourne, Sch Chem, Melbourne, Vic 3010, Australia
[2] Univ Western Sydney, Sch Nat Sci, Penrith 1797, Australia
[3] Univ New S Wales, Sch Chem, Sydney, NSW 2052, Australia
[4] Australian Synchrotron, Clayton, Vic 3168, Australia
基金
澳大利亚研究理事会;
关键词
Aluminium oxide thin films; Solvothermal; Aluminium(III) diisopropylcarbamate; X-ray photoelectron spectroscopy; Near edge X-ray absorption fine structure; THERMAL-DECOMPOSITION; VAPOR-DEPOSITION; SPECTRA; MOCVD; SILICON; GROWTH;
D O I
10.1016/j.tsf.2010.01.006
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
At elevated pressure, stoichiometric and high quality Al2O3 thin films are fabricated at 65-105 degrees C. By using pre-organised single source precursor aluminium(III) diisopropylcarbamate, Al2O3 were deposited on the surface of a Si substrate in a single step in the liquid phase. Comprehensive removal of large carbamate ligands by proposed beta-elimination during decomposition of precursor led to an effective delivery of enshrouded Al-O fragments. Scanning electron microscopy revealed dense and grainy surface morphology. The thicknesses of the films were measured to be 150-300 nm and independent to reaction temperatures or reaction times. Through the use of near edge X-ray absorption fine structure spectroscopy. Al absorption peaks suggest a short range crystalline formation in a film deposited at 105 degrees C. (C) 2010 Elsevier BM. All rights reserved.
引用
收藏
页码:4290 / 4293
页数:4
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