Using a buffered rinse solution to minimize metal contamination after wafer cleaning

被引：0

作者：

Small, RJ ^{[1
]}

Peterson, ML ^{[1
]}

Robles, A ^{[1
]}

Kempa, D ^{[1
]}

Knittel, J ^{[1
]}

机构：

[1] EKC Technol, R&D Grp, Hayward, CA 94545 USA

来源：

MICRO | 1998年 / 16卷 / 01期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Chemical cleaning

引用

页码：61 / +

页数：6

共 27 条

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[27] "Engineering Escherichia coli BL21(DE3) Derivative Strains To Minimize E. coli Protein Contamination after Purification by Immobilized Metal Affinity Chromatography" (vol 77, pg.no 4634-4646, 2011)
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