Using a buffered rinse solution to minimize metal contamination after wafer cleaning

被引：0
|
作者：
Small, RJ [1 ]
Peterson, ML [1 ]
Robles, A [1 ]
Kempa, D [1 ]
Knittel, J [1 ]
机构：
[1] EKC Technol, R&D Grp, Hayward, CA 94545 USA
来源：
MICRO | 1998年 / 16卷 / 01期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Chemical cleaning
引用
收藏
页码：61 / +
页数：6
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