A 70 GHz Bidirectional Front-End for a Half-Duplex Transceiver in 90-nm SiGe BiCMOS

被引:0
|
作者
Kijsanayotin, Tissana [1 ]
Li, Jun [1 ]
Buckwalter, James F. [2 ]
机构
[1] Univ Calif San Diego, Dept Elect & Comp Engn, La Jolla, CA 92093 USA
[2] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
关键词
Bidirectional; switchless; PALNA; passive mixer; mm-wave; E-band; pulse radar; time-division duplexing; point-to-point communication; CMOS; SWITCH; CHIP;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a 70 GHz bidirectional front-end transceiver circuit in a 90-nm SiGe BiCMOS process. The design consists of a bidirectional power amplifier/low-noise amplifier (PALNA) and a passive mixer. Isolation between the transmitter (TX) and receiver (RX) is achieved with a passive impedance transformation network, eliminating the need for a high frequency transmit/receive switch. Measurement results show the transmitter has a peak output power of 7.2 dBm and a peak conversion gain of 14.5 dB while nominally consumes 47 mA from a 1.8 V supply. The receiver has a peak conversion gain of 9.9 dB and a minimum noise figure of 8.6 dB with nominal current consumption of 18 mA from a 1.5 V supply. This switchless bidirectional front-end is suitable for a half-duplex system with shared TX/RX antenna such as a pulse-compression range sensor or a time-division duplexing (TDD) point-to-point communication system in E-band.
引用
收藏
页数:4
相关论文
共 50 条
  • [21] A Wideband Ka-band Receiver Front-End in 90-nm CMOS Technology
    Li, Zhiqun
    Cao, Jia
    Li, Qin
    Wang, Zhigong
    2013 8TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2013, : 5 - 8
  • [22] A Fully Integrated 120-GHz Six-Port Receiver Front-End in a 130-nm SiGe BiCMOS Technology
    Laemmle, Benjamin
    Schmalz, Klaus
    Borngraeber, Johannes
    Scheytt, J. Christoph
    Weigel, Robert
    Koelpin, Alexander
    Kissinger, Dietmar
    2013 IEEE 13TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), 2013, : 129 - 131
  • [23] A 78 ∼ 102 GHz Front-End Receiver in 90 nm CMOS Technology
    Su, Hsuan-Yi
    Hu, Robert
    Wu, Chung-Yu
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2011, 21 (09) : 489 - 491
  • [24] W-Band Dual-Polarization Phased-Array Transceiver Front-End in SiGe BiCMOS
    Natarajan, Arun
    Valdes-Garcia, Alberto
    Sadhu, Bodhisatwa
    Reynolds, Scott K.
    Parker, Benjamin D.
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2015, 63 (06) : 1989 - 2002
  • [25] A SiGe BiCMOS 24-GHz receiver front-end for automotive short-range radar
    Egidio Ragonese
    Angelo Scuderi
    Vittorio Giammello
    Giuseppe Palmisano
    Analog Integrated Circuits and Signal Processing, 2011, 67 : 121 - 130
  • [26] Compact low-power 154 GHz receiver front-end in 0.13 μm SiGe BiCMOS
    Li, Huanbo
    Chen, Jixin
    Zhou, Peigen
    Yu, Jiayang
    Yan, Pinpin
    Hou, Debin
    Hong, Wei
    IET MICROWAVES ANTENNAS & PROPAGATION, 2020, 14 (09) : 955 - 959
  • [27] A SiGe BiCMOS 24-GHz receiver front-end for automotive short-range radar
    Ragonese, Egidio
    Scuderi, Angelo
    Giammello, Vittorio
    Palmisano, Giuseppe
    ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2011, 67 (02) : 121 - 130
  • [28] A G-Band Wideband Bidirectional Transceiver Front-End in 40-nm CMOS
    Liu, Yibo
    Ma, Taikun
    Guan, Pingda
    Mao, Luhong
    Chi, Baoyong
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2019, 66 (05) : 798 - 802
  • [29] A Low-Power and Ultra-Compact W-band Transmitter Front-End in 90 nm SiGe BiCMOS Technology
    Chi, Taiyun
    Park, Jong Seok
    Schmid, Robert L.
    Ulusoy, A. Cagri
    Cressler, John D.
    Wang, Hua
    2014 IEEE BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING (BCTM), 2014, : 155 - 158
  • [30] A 1.42-mm2 0.45-0.49 THz Monostatic FMCW Radar Transceiver in 90-nm SiGe BiCMOS
    Mangiavillano, Christoph
    Kaineder, Alexander
    Aufinger, Klaus
    Stelzer, Andreas
    IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2022, 12 (06) : 592 - 602