Interface characteristics in diffusion bonding of a γ-TiAl alloy to Ti-6Al-4V

被引：14
|
作者：
Wang, XiuFeng
Ma, Mo
Liu, XueBin
Lin, JianGuo [1 ]
机构：
[1] Xiangtan Univ, Key Lab Low Dimens Mat & Applicat Technol, Xiangtan 411105, Hunan, Peoples R China
[2] Xiangtan Univ, Fac Mat & Photoelect Phys, Xiangtan 411105, Hunan, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE | 2007年 / 42卷 / 11期
基金：
中国国家自然科学基金;
关键词：
D O I：
10.1007/s10853-006-0189-2
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In the present study, diffusion bonding of a gamma-TiAl alloy to a Ti-6Al-4V alloy at the different temperatures ranging from 1073 to 1173 K under an applied stress of 100 MPa for 2 h was investigated. The observation of the microstructure revealed that sound joints between the gamma-TiAl Alloy and the Ti-alloy without any pores or cracks could be achieved through diffusion bonding at temperatures over 1073 K under the applied stress of 100 MPa for 2 h. The bond was composed of two zones, and its width increases with the increase of the bonding temperature. The EDS chemical composition profiles indicated that there is a diffusion flux of Al-atoms from gamma-TiAl alloy towards the Ti-alloy and of Ti-atoms in the opposite direction. The microhardness of the diffusion bond was in the range of 310-450 HV, and increased monotonously from the side near the gamma-TiAl alloy to the side near the Ti-alloy. In this bonding process, the diffusion flux of Ti atoms in interface is mainly controlled by grain boundary diffusion.
引用
收藏
页码：4004 / 4008
页数：5
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