Microstructure and High Temperature Plastic Deformation Behavior of Al-12Si Based Alloy Fabricated by an Electromagnetic Casting and Stirring Process

An as-received EMC/S (electromagnetic casting and stirring)-processed Al-12Si based alloy billet was homogenized to examine its microstructure and high temperature plastic deformation behavior, using compressive tests over the temperature range from 623 to 743 K and a strain rate range from 1.0x10(3) to 1.0X10 s(-1). The results were compared with samples processed by the direct chill casting (DC) method. The fraction of equiaxed structure for the as-received EMC/S billet(41%) was much higher than that of the as-received DC billet(6%). All true stress- true strain curves acquired from the compressive tests exhibited a peak stress at the initial stage of plastic deformation. Flow stress showed a steady state region after the appearance of peak stress with increasing strain. The peak stress decreased with increasing temperature at a given strain rate and a decreasing strain rate at a given temperature. A constitutive equation was made for each alloy, which could be used to predict the peak stress. A recrystallized grain structure was observed in all the deformed specimens, indicating that dynamic recrystallization is the predominant mechanism during high temperature plastic deformation of both the homogenized EMC/S and DC-processed Al-12Si based alloys.