Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼ 5 x 1015 neq/cm2

被引：7

作者：

Boscardin, M. ^{[1
,2
]}

Ceccarelli, R. ^{[3
,4
]}

Dalla Betta, G. F. ^{[2
,5
]}

Darbo, G. ^{[6
]}

Dinardo, M. E. ^{[7
,8
]}

Giacomini, G. ^{[1
,13
]}

Menasce, D. ^{[8
]}

Mendicino, R. ^{[2
,5
]}

Meschini, M. ^{[4
]}

Messineo, A. ^{[9
,10
]}

Moroni, L. ^{[8
]}

Rivera, R. ^{[11
]}

Ronchin, S. ^{[1
]}

Sultan, D. M. S. ^{[2
,5
,14
]}

Uplegger, L. ^{[11
]}

Viliani, L. ^{[4
]}

Zoi, I ^{[12
]}

Zuolo, D. ^{[7
,8
]}

机构：

[1] Fdn Bruno Kessler, Trento, Italy

[2] Ist Nazl Fis Nucl, TIFPA, Trento, Italy

[3] Univ Firenze, Florence, Italy

[4] Ist Nazl Fis Nucl, Florence, Italy

[5] Univ Trento, Trento, Italy

[6] Ist Nazl Fis Nucl, Genoa, Italy

[7] Univ Milano Bicocca, Milan, Italy

[8] INFN Bicocca, Milan, Italy

[9] Univ Pisa, Pisa, Italy

[10] Ist Nazl Fis Nucl, Pisa, Italy

[11] Fermilab Natl Accelerator Lab, POB 500, Batavia, IL 60510 USA

[12] Hamburg Univ, Hamburg, Germany

[13] Brookhaven Natl Lab, Upton, NY 11973 USA

[14] Univ Geneva, Geneva, Switzerland

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2020年 / 953卷

基金：

欧盟地平线“2020”;

关键词：

Pixel; Silicon; Sensor; Planar; 3D; Radiation hard; HL-LHC;

D O I：

10.1016/j.nima.2019.163222

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 10(16) n(eq)/cm(2) at similar to 3 cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n(+) on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100 mu m or 130 mu m, that of 3D sensors 130 mu m. First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. First results on their performance before and after irradiation up to a maximum fluence of similar to 5 x 10(15) n(eq)/cm(2) are reported in this article.

引用

页数：8

共 6 条

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Mandic, Igor
Cindro, Vladimir
Gorisek, Andrej
Kramberger, Gregor
Mikuz, Marko
Zavrtanik, Marko
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2010, 612 (03): : 474 - 477
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Dalla Betta, G. F.
Boscardin, M.
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Dinardo, M. E.
Giacomini, G.
Menasce, D.
Meschini, M.
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