Proposing a novel passive vascular self-cooling system

In this study, an innovative system is introduced to cool down the electronic components in the case of a malfunction of the equipment. A rectangular piece is considered in which heat is generated, while parallel channels are embedded into it to cool the element. In some of these channels (active channels), the cooling fluid flows, while in others (passive channels) fluid is stationary. The active and passive channels are placed alternately and separated by micro-thermostats. When malfunction happens, the heat flux is increased in an arbitrary spot of the piece, opening the closest thermostat and turning the adjacent passive channel into active channel. Therefore, the coolant flow at that portion is increased which dissipates the surcharge heat. The fluid flow is steady and laminar. The thermal entry length is considered, and the effect of local pressure loss is studied. The governing equations are resolved, analytically. Five different cases are studied. At three cases, one hot spot occurs at different locations; while at the other two cases, two hot spots happen simultaneously over the electronic board. Results show that invoking the recommended system at a malfunction situation can reduce the maximum temperature of the electronic piece up to 13.3, 15.2, 17.2, 19.3 and 17.0 degrees C for cases I-V, respectively; for hot spot heat flux 40 kW m(-2).