Thermal measurement and numerical analysis for automotive power modules

被引：9
|
作者：
Sitta, Alessandro [1 ,2 ]
Renna, Marco [1 ]
Messina, Angelo Alberto [3 ,4 ]
Sequenzia, Gaetano [2 ]
D'Arrigo, Giuseppe [4 ]
Calabretta, Michele [1 ]
机构：
[1] STMicroelectronics, FE BE Fus, ADG R&D, Catania, Italy
[2] Univ Catania, Dipartimento Ingn Informat Elettr & Elettron, Catania, Italy
[3] STMicroelectronics, Italy Publ Affairs, Catania, Italy
[4] CNR, IMM, Catania, Italy
来源：
2020 21ST INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) | 2020年
关键词：
RELIABILITY;
D O I：
10.1109/eurosime48426.2020.9152204
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The presented analysis has been aimed to evaluate the impact of die solder and sintering solution for automotive power modules in terms of thermal behavior. First, dedicated temperature measurements have been performed to evaluate the module thermal impedance in the two cases. Then, a lumped equivalent networks has been calculated, by means of a dedicated numeric, and finally function structures have been extracted
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页数：3
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