Two-Layer High-Throughput: Effective Mass Calculations Including Warping

被引:2
|
作者
Supka, Materials Genome Engineering-Article Andrew [1 ]
Mecholsky, Nicholas A. [2 ]
Nardelli, Marco Buongiorno [3 ,4 ]
Curtarolo, Stefano [4 ,5 ]
Fornari, Marco [1 ,4 ]
机构
[1] Cent Michigan Univ, Dept Phys & Sci Adv Mat Program, Mt Pleasant, MI 48859 USA
[2] Catholic Univ Amer, Dept Phys & Vitreous State Lab, Washington, DC 20064 USA
[3] Univ North Texas, Dept Phys & Dept Chem, Denton, TX 76203 USA
[4] Duke Univ, Ctr Autonomous Mat Design, Durham, NC 27708 USA
[5] Duke Univ, Dept Mech Engn & Mat Sci, Durham, NC 27708 USA
来源
ENGINEERING | 2022年 / 10卷
关键词
High-throughput; Electronic structure; Band warping; Effective mass; ELECTRON EFFECTIVE MASSES; CYCLOTRON-RESONANCE; SPIN-RESONANCE; DRIFT VELOCITY; VALENCE-BAND; GAAS; SEMICONDUCTORS; SCATTERING; TRANSPORT; SILICON;
D O I
10.1016/j.eng.2021.03.031
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, we perform two-layer high-throughput calculations. In the first layer, which involves changing the crystal structure and/or chemical composition, we analyze selected III-V semiconductors, filled and unfilled skutterudites, as well as rock salt and layered chalcogenides. The second layer searches the full Brillouin zone (BZ) for critical points within 1.5 eV (1 eV =1.602176 x 10-19 J) of the Fermi level and characterizes those points by computing the effective masses. We introduce several methods to compute the effective masses from first principles and compare them to each other. Our approach also includes the calculation of the density-of-states effective masses for warped critical points, where traditional approaches fail to give consistent results due to an underlying non-analytic behavior of the critical point. We demonstrate the need to consider the band structure in its full complexity and the value of complementary approaches to compute the effective masses. We also provide computational evidence that warping occurs only in the presence of degeneracies. (c) 2022 THE AUTHORS. Published by Elsevier LTD on behalf of Chinese Academy of Engineering and Higher Education Press Limited Company. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
收藏
页码:74 / 80
页数:7
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