A new measurement approach for interface thermal resistance using frequency-scan photothermal reflectance technique

被引:9
|
作者
Hua, Zilong [1 ]
Ban, Heng [1 ]
机构
[1] Utah State Univ, Mech & Aerosp Engn Dept, Logan, UT 84322 USA
关键词
Interface thermal resistance; Photothermal reflectance technique; Effective thermal diffusivity; THERMOREFLECTANCE; CONDUCTIVITY; MICROSCOPY;
D O I
10.1016/j.ijthermalsci.2017.03.005
中图分类号
O414.1 [热力学];
学科分类号
摘要
A new approach to measuring the thermal resistance of an interface perpendicular to the measurement surface is developed based on the frequency-scan photothermal reflectance technique. Interface thermal resistance, also known as Kapitza resistance, of natural interfaces such as grain boundaries plays an important role in the bulk thermal conductivity of a polycrystalline material. The objective of this study is to show the feasibility of the new technique as an initial attempt towards the eventual goal of measuring the Kapitza resistance of natural grain boundaries. The thermal resistance of an interface perpendicular to the surface of measurement is extracted by measuring the relative reduction of local thermal diffusivity across the interface. The experimental result on a sample of two single crystal silicon bonded together agrees with data obtained by the reference spatial-scan measurement. The experimental uncertainty is estimated and methods to minimize the measurement errors are discussed. The new approach is able to provide accurate measurement of interface thermal resistance within a certain range. (C) 2017 Published by Elsevier Masson SAS.
引用
收藏
页码:59 / 67
页数:9
相关论文
共 50 条
  • [21] A new technique for thermal resistance measurement in power electron devices
    Filicori, F
    Rinaldi, P
    Vannini, G
    Santarelli, A
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2005, 54 (05) : 1921 - 1925
  • [22] Measurement of thermal diffusivity based on the photothermal displacement technique using the minimum phase method
    Lee, E.H.
    Lee, K.J.
    Jeon, P.S.
    Yoo, J.
    2000, American Inst of Physics, Woodbury, NY, USA (88)
  • [23] Measurement of thermal diffusivity based on the photothermal displacement technique using the minimum phase method
    Lee, EH
    Lee, KJ
    Jeon, PS
    Yoo, J
    JOURNAL OF APPLIED PHYSICS, 2000, 88 (01) : 588 - 590
  • [24] Highly Porous Metal Foams: Effective Thermal Conductivity Measurement Using a Photothermal Technique
    Fetoui, Mourad
    Albouchi, Fethi
    Rigollet, Fabrice
    Ben Nasrallah, Sassi
    JOURNAL OF POROUS MEDIA, 2009, 12 (10) : 939 - 954
  • [25] Thermal characterization of gallium arsenic nitride epilayer on gallium arsenide substrate using pulsed photothermal reflectance technique
    Zhao, YM
    Chen, G
    Wang, SZ
    Yoon, SF
    THIN SOLID FILMS, 2004, 450 (02) : 352 - 356
  • [26] Transient Dual Interface Measurement - A New JEDEC Standard for the Measurement of the Junction-to-Case Thermal Resistance
    Schweitzer, Dirk
    Pape, Heinz
    Chen, Liu
    Kutscherauer, Rudolf
    Walder, Martin
    2011 27TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2011, : 222 - 229
  • [27] Measurement of Thermal Conductivity and Interfacial Thermal Resistance of Bismuth Film Deposited on Sapphire Substrate by Frequency Domain Thermo-Reflectance Method
    Kato, R.
    Xu, Y.
    THERMAL CONDUCTIVITY 30:THERMAL EXPANSION 18, 2010, 30 : 926 - 926
  • [28] Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film
    Chien, Heng-Chieh
    Yao, Da-Jeng
    Huang, Mei-Jiau
    Chang, Tien-Yao
    REVIEW OF SCIENTIFIC INSTRUMENTS, 2008, 79 (05):
  • [29] A TECHNIQUE FOR INTERFACE THERMAL RESISTANCE MEASUREMENTS BETWEEN A NANOELECTRODE AND A SUBSTRATE USING THE 3ω METHOD
    Son, Youngsuk
    Mazumder, Monalisa
    Borca-Tasciuc, Theodorian
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 13, PTS A AND B, 2009, : 1283 - 1285
  • [30] Thermal diffusivity measurement of polymeric thin films using the photothermal displacement technique. II. On-wafer measurement
    Hu, CA
    Ogawa, ET
    Ho, PS
    JOURNAL OF APPLIED PHYSICS, 1999, 86 (11) : 6028 - 6038