The Correlation Between Trap States and Mechanical Reliability of Amorphous Si:H TFTs for Flexible Electronics

被引:0
|
作者
Lee, M. H. [1 ]
Chang, S. T. [2 ]
Weng, S. -C. [1 ]
Liu, W. -H. [1 ]
Chen, K. -J. [1 ]
Ho, K. -Y. [3 ]
Liao, M. H. [4 ]
Huang, J. -J. [3 ]
Hu, G. -R. [3 ]
机构
[1] Natl Taiwan Normal Univ, Inst Electroopt Sci & Technol, Taipei 116, Taiwan
[2] Natl Chung Hsing Univ, Dept Elect Engn, Taichung 402, Taiwan
[3] Ind Technol Res Inst, Display Technol Ctr, Hsinchu 310, Taiwan
[4] Taiwan Semicond Mfg Co Ltd, Res & Dev, Hsinchu 300, Taiwan
关键词
flexible; a-Si:H; mechanical strain; trap state; SILICON; TRANSISTORS;
D O I
10.1109/IRPS.2009.5173388
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
The disordered bonds may generate a redistribution of trap states, resulting in unstable electrical characteristics such as threshold voltage, subthreshold swing, and mobility of carriers. The weak or broken bonds may contribute to the redistribution of trap states, and lead to unstable electrical characteristics of the a-Si:H TFTs on plastic substrates. We conclude that the DOS of an a-Si:H layer under mechanical strain is the fundamental reliability issue for the development of flexible electronics.
引用
收藏
页码:956 / +
页数:2
相关论文
共 50 条
  • [31] Enhancing Reliability and 2 mm-Axial Mechanical Bending Endurance by Gate Insulator Improvements in Flexible Polycrystalline Silicon TFTs
    Zheng, Yu-Zhe
    Chen, Po-Hsun
    Chang, Ting-Chang
    Tsai, Tsung-Ming
    Zhou, Kuan-Ju
    Tu, Yu-Fa
    Wang, Yu-Xuan
    Wu, Chia-Chuan
    Chen, Yu-An
    Sun, Pei-Jun
    Chen, Juan-Jie
    Tu, Hong-Yi
    Hung, Yang-Hao
    Lin, Yu-Shan
    Ciou, Fong-Min
    Shih, Yu-Shan
    Huang, Hui-Chun
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (05) : 2423 - 2429
  • [32] Modelling and Parameters Extraction of Flexible Amorphous Silicon Solar Cell a-Si:H
    Louzazni M.
    Khouya A.
    Crăciunescu A.
    Amechnoue K.
    Mussetta M.
    Louzazni, Mohamed (louzazni@msn.com), 1600, Pleiades journals (56): : 1 - 12
  • [33] Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate
    Ko, Yong-Ho
    Kim, Min-Su
    Bang, Junghwan
    Kim, Taek-Soo
    Lee, Chang-Woo
    JOURNAL OF ELECTRONIC MATERIALS, 2015, 44 (07) : 2458 - 2466
  • [34] Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate
    Yong-Ho Ko
    Min-Su Kim
    Junghwan Bang
    Taek-Soo Kim
    Chang-Woo Lee
    Journal of Electronic Materials, 2015, 44 : 2458 - 2466
  • [35] OCCUPATION DYNAMICS OF TRAP STATES IN AN A-SI-H THIN-FILM TRANSISTOR
    BULLOCK, JN
    WU, CH
    JOURNAL OF APPLIED PHYSICS, 1991, 69 (02) : 1041 - 1046
  • [36] ANALYTICAL DRAIN CURRENT MODEL FOR A-SI-H TFTS BY SIMULTANEOUSLY CONSIDERING LOCALIZED DEEP AND TAIL STATES
    KUO, JB
    CHEN, CS
    ELECTRONICS LETTERS, 1993, 29 (17) : 1566 - 1568
  • [37] Correlation between micro-roughness, surface chemistry, and performance of crystalline Si/amorphous Si:H:Cl hetero-junction solar cells
    Matsui, H.
    Saito, T.
    Saha, J. K.
    Shirai, H.
    JOURNAL OF NON-CRYSTALLINE SOLIDS, 2008, 354 (19-25) : 2483 - 2487
  • [38] Correlation between light emissions from amorphous-Si:H/SiO2 and nc-Si/SiO2 multilayers
    Ma Zhong-Yuan
    Han Pei-Gao
    Li Wei
    Chen De-Yuan
    Wei De-Yuan
    Qian Bo
    Li Wei
    Xu Jun
    Xu Ling
    Huang Xin-Fan
    Chen Kun-Ji
    Feng Duan
    CHINESE PHYSICS LETTERS, 2007, 24 (07) : 2064 - 2067
  • [39] THE CORRELATION BETWEEN PHOTOCREATION OF DANGLING BONDS AND SI-H BOND CLUSTERS IN A-SI-H
    MORIGAKI, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1990, 29 (09): : L1582 - L1584
  • [40] Correlation Between Structure and Mechanical Properties of Amorphous Cu-Ag Alloys
    Belouarda, Kaoutar
    Kbirou, Meryem
    Saadouni, Khalid
    Badawi, Michael
    Mazroui, M'hammed
    PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, 2021, 258 (03):