Microscale Thermal Transport and Electromechanical Microfluidic Actuation

被引:2
|
作者
Garimella, Suresh V. [1 ,2 ]
Liu, Dong [3 ]
机构
[1] Purdue Univ, NSF Cooling Technol Res Ctr, Sch Mech Engn, W Lafayette, IN 47907 USA
[2] Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA
[3] Univ Houston, Dept Mech Engn, Houston, TX 77204 USA
基金
美国国家科学基金会;
关键词
microscale; thermal transport; microfluidic actuation; electromechanical actuation; micropump; BOILING HEAT-TRANSFER; MICROPARTICLE IMAGE VELOCIMETRY; NUCLEATION SITE DENSITY; EVAPORATING THIN-FILM; TRANSFER COEFFICIENT; EXTENDED MENISCUS; FLUID-FLOW; SURFACE; MODEL; AIR;
D O I
10.1615/JEnhHeatTransf.v16.i3.30
中图分类号
O414.1 [热力学];
学科分类号
摘要
This paper summarizes recent advances in fundamental research on microscale thermal transport in phase-change processes and developments in novel microfluidic actuation methods using electromechanical effects. The research topics covered include thin-film transport, pool boiling heat transfer enhancement, convective flow boiling in microchannels, microscale ionic winds, micropumping using electrohydrodynamic effects including ion induction and dielectrophoresis, and electrowetting-based control of liquid droplet motion. Progress in microscale flow characterization and non-intrusive temperature measurement is also discussed.
引用
收藏
页码:237 / 266
页数:30
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