Microfabricated Testbench for High Throughput Measurement of Thermal and Thermoelectric Properties of Low-Dimensional Materials

被引:2
|
作者
Kim, DukSoo [1 ]
Kally, James [2 ]
Samarth, Nitin [3 ]
Tadigadapa, Srinivas [1 ]
机构
[1] Penn State Univ, Dept Elect Engn, University Pk, PA 16802 USA
[2] Penn State Univ, Dept Mat Sci & Engn, University Pk, PA 16802 USA
[3] Penn State Univ, Dept Phys, University Pk, PA 16802 USA
基金
美国国家科学基金会;
关键词
Low-dimensional materials; microfabricated testbench; Seebeck coefficient; thermal conductivity; thermoelectric figure of merit; manganese arsenide nanowire; CONDUCTIVITY; NANOWIRES; FIGURE;
D O I
10.1109/JMEMS.2016.2646799
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have developed a microfabricated testbench to measure the electrical, thermal, and thermoelectric properties of low-dimensional materials. In this unique design, a number of platform tips (test benches) are gathered in the central area of the chip for increased probability of positioning a bottom-up synthesized single nanomaterial structure across two platform tips when such materials are drop cast from a solution. Each platform has an embedded heater to heat the platform tip and a thermocouple to accurately measure its temperature. Electrically isolated from the thermocouple and heater structure, a top layer platinum on each platform is used to electrically connect to the low-dimensional material. Electrical conductivity, thermal conductivity, Seebeck coefficient, and ZT of GaAs/MnAs core/shell nanowires were successfully measured using testbench in the temperature range of 25 to 300 K.
引用
收藏
页码:396 / 405
页数:10
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