Adhesion and mechanical reliability of microelectronic devices and their packages

被引：0
|
作者：
Dauskardt, RH [1 ]
机构：
[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
来源：
PROCEEDINGS OF THE SEM IX INTERNATIONAL CONGRESS ON EXPERIMENTAL MECHANICS | 2000年
关键词：
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
引用
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页码：888 / 888
页数：1
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