Connecting Copper Wire to Thin Metal Layers

被引：0
|
作者：
Michael, Pasteka [1 ]
Marian, Kralik [1 ]
Peter, Hladis [1 ]
机构：
[1] Slovak Univ Technol Bratislava, Fac Mech Engn, Bratislava, Slovakia
来源：
TEM JOURNAL-TECHNOLOGY EDUCATION MANAGEMENT INFORMATICS | 2019年 / 8卷 / 03期
关键词：
electrical bond; connecting; thin metal layers; weld; pressure;
D O I：
10.18421/TEM83-05
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
The process or a system of creating connection between two electrical conductive materials is referred to as heat bonding. In this case it is correct to call it micro bonding. Essential characteristics of this process are pressing two materials together and applying heat. Similar processes are used to create connections to LCDs (Liquid crystal displays) or PCB. This paper discusses copper wire bonding technology to a thin metal layer made on dielectric sheet for micro coils.
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收藏
页码：728 / 732
页数：5
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