Verifiable Improvements of Finite Element Stresses at Three-Dimensional Stress Concentrations

被引:0
|
作者
Beisheim, J. R. [1 ]
Sinclair, G. B. [2 ]
机构
[1] Ansys Inc, Canonsburg, PA 15317 USA
[2] Louisiana State Univ, Dept Mech Engn, Baton Rouge, LA 70803 USA
关键词
finite elements; solution verification; convergence checks; a posteriori error estimates; stress extrapolation; elasticity; stress concentrations;
D O I
10.1115/1.4056395
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
While current computational capability has led to finite element analysis becoming the predominant means of assessing three-dimensional stress concentrations, there are nonetheless some three-dimensional configurations where the desired level of accuracy of stresses is not realized on the finest mesh used. Here, we offer some simple means of improving the accuracy of finite element stresses for such configurations, and doing so with modest increases in computational effort. These improved stresses are obtained by using an adaptation of Richardson extrapolation on original mesh results, and also on mesh results with a reduced mesh refinement factor. Verification of the improvements is undertaken using the convergence checks and error estimates reported earlier. The approach is applied to nine three-dimensional test problems. Finite element analysis of these test problems leads to eleven stresses on the finest meshes used that could benefit from being improved. The extrapolation procedure in conjunction with the reduced refinement factor improved all eleven stresses. Error estimates confirmed these improvements for all eleven.
引用
收藏
页数:9
相关论文
共 50 条
  • [41] Finite element modeling of heat transfer and thermal stresses for three-dimensional packaging of power electronics modules
    Wen, SS
    Lu, GQ
    IPEMC 2000: THIRD INTERNATIONAL POWER ELECTRONICS AND MOTION CONTROL CONFERENCE, VOLS 1-3, PROCEEDINGS, 2000, : 496 - 501
  • [42] Factors affecting stresses in cortical bone around miniscrew implants A three-dimensional finite element study
    Duaibis, Ramzi
    Kusnoto, Budi
    Natarajan, Raghu
    Zhao, Linping
    Evans, Carla
    ANGLE ORTHODONTIST, 2012, 82 (05) : 875 - 880
  • [43] Three-dimensional finite element analysis of subsurface stresses and shakedown due to repeated sliding on a layered medium
    Kral, ER
    Komvopoulos, K
    JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 1996, 63 (04): : 967 - 973
  • [44] Stress Distribution in Human Zygomatic Pillar Using Three-Dimensional Finite Element Analysis
    Prado, Felippe Bevilacqua
    Noritomi, Pedro Yoshito
    Freire, Alexandre Rodrigues
    Rossi, Ana Claudia
    Neto, Francisco Haiter
    Ferreira Caria, Paulo Henrique
    INTERNATIONAL JOURNAL OF MORPHOLOGY, 2013, 31 (04): : 1386 - 1392
  • [45] Stress analysis in the TMJ during clenching by three-dimensional finite element method.
    Kawakami, T
    Miyawaki, S
    Matsumoto, T
    Miyamura, K
    Baba, M
    Sugimura, M
    Takano-Yamamoto, T
    JOURNAL OF DENTAL RESEARCH, 2002, 81 : A449 - A449
  • [46] Three-dimensional finite-element analysis of taper screw stress of extruder for straw
    Zhang, Zuli
    Shao, Yue
    Nongye Gongcheng Xuebao/Transactions of the Chinese Society of Agricultural Engineering, 2006, 22 (10): : 126 - 129
  • [47] Finite-Element Analysis of Residual Stresses Generated Under Nitriding Process: a Three-Dimensional Model
    J. Sawicki
    P. Siedlaczek
    A. Staszczyk
    Metal Science and Heat Treatment, 2018, 59 : 799 - 804
  • [48] Three-dimensional finite element analysis of stress distribution in different type of fixture applications
    Fioratti, R
    Guida, A
    Lupoli, G
    Eramo, S
    Giuca, MR
    JOURNAL OF DENTAL RESEARCH, 2003, 82 : 552 - 552
  • [49] A THREE-DIMENSIONAL COUPLED FINITE ELEMENT MODEL FOR THE SIMULATION OF STRESS CORROSION ON PIPELINE STEEL
    Sun, Dongxu
    Wu, Ming
    Xie, Fei
    Gong, Ke
    PROCEEDINGS OF THE ASME ASIA PACIFIC PIPELINE CONFERENCE, 2019, 2019,
  • [50] Three-dimensional finite element simulation of electro and stress migration effects in interconnect lines
    Rzepka, S
    Korhonen, MA
    Weber, ER
    Li, CY
    MATERIALS RELIABILITY IN MICROELECTRONICS VII, 1997, 473 : 329 - 335