Ablation enhancement of silicon by ultrashort double-pulse laser ablation

被引:55
|
作者
Zhao, Xin [1 ]
Shin, Yung C. [1 ]
机构
[1] Purdue Univ, Sch Mech Engn, Ctr Laser Based Mfg, W Lafayette, IN 47907 USA
基金
美国国家科学基金会;
关键词
MOLECULAR-DYNAMICS SIMULATION; MANIPULATION;
D O I
10.1063/1.4896350
中图分类号
O59 [应用物理学];
学科分类号
摘要
In this study, the ultrashort double-pulse ablation of silicon is investigated. An atomistic simulation model is developed to analyze the underlying physics. It is revealed that the double-pulse ablation could significantly increase the ablation rate of silicon, compared with the single pulse ablation with the same total pulse energy, which is totally different from the case of metals. In the long pulse delay range (over 1 ps), the enhancement is caused by the metallic transition of melted silicon with the corresponding absorption efficiency. At ultrashort pulse delay (below 1 ps), the enhancement is due to the electron excitation by the first pulse. The enhancement only occurs at low and moderate laser fluence. The ablation is suppressed at high fluence due to the strong plasma shielding effect. (c) 2014 AIP Publishing LLC.
引用
收藏
页数:4
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