Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

被引：32
|
作者：
Yeung, B [1 ]
Jang, JW [1 ]
机构：
[1] Motorola Inc, Tempe, AZ 85284 USA
来源：
JOURNAL OF MATERIALS SCIENCE LETTERS | 2002年 / 21卷 / 09期
关键词：
D O I：
10.1023/A:1015741206911
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The mechanical property-microstructural relationship of eutectic Sn-3.5Ag was investigated with respect to heat-treatment conditions. It was found that the yield strength was primarily dependent on the grain size of the tin-rich phase while the size of the Ag3Sn intermetallics was similar in all heat treatment conditions. In addition, a slightly disturbed lamella structuure was found after solder paste was reflowed. This may be ascribed to the burning of organic content in the paste.
引用
收藏
页码：723 / 726
页数：4
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