Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux

Composite materials consisting of two dissimilar elastic half-planes bonded by a nonhomogeneous elastic layer contain two interface cracks; one is situated at the lower interface between the layer and the lower half-plane, while the other is situated at the upper interface between the layer and the upper dissimilar half-plane. The stress intensity factors are solved under uniform heat flux normal to the cracks. The material properties of the bonding layer vary continuously from the lower half-plane to the upper half-plane. The boundary conditions are reduced to dual integral equations using the Fourier transform technique, and they are satisfied outside the cracks by expanding the differences in temperature and displacements at the crack surfaces using a series of functions that vanish outside the cracks. The unknown coefficients in each series are evaluated using the Schmidt method. The stress intensity factors were calculated numerically for selected crack configurations.