Emergence of high quality sputtered III-nitride semiconductors and devices

被引:38
|
作者
Izyumskaya, N. [1 ]
Avrutin, V [1 ]
Ding, K. [1 ]
Ozgur, U. [1 ]
Morkoc, H. [1 ]
Fujioka, H. [2 ,3 ]
机构
[1] Virginia Commonwealth Univ, Dept Elect & Comp Engn, Richmond, VA 23284 USA
[2] Univ Tokyo, Inst Ind Sci, Meguro Ku, Tokyo 1538505, Japan
[3] Japan Sci & Technol Agcy JST, ACCEL, Chiyoda Ku, Tokyo 1020075, Japan
关键词
sputtering; III-nitrides; GaN; AlN; InGaN; light emitting diodes; field-effect transistors; LIGHT-EMITTING-DIODES; PATTERNED SAPPHIRE SUBSTRATE; ALN BUFFER LAYER; MOLECULAR-BEAM EPITAXY; HETERO-JUNCTION DIODE; GAN THIN-FILMS; STRUCTURAL-PROPERTIES; DOPED GAN; HETEROEPITAXIAL GROWTH; ELECTRICAL-PROPERTIES;
D O I
10.1088/1361-6641/ab3374
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article provides an overview of recent development of sputtering method for high-quality III-nitride semiconductor materials and devices. Being a mature deposition technique widely employed in semiconductor industry, sputtering offers many advantages such as low cost, relatively simple equipment, non-toxic raw materials, low process temperatures, high deposition rates, sharp interfaces, and possibility of deposition on large-size substrates, including amorphous and flexible varieties. This review covers two major research directions: (1) ex situ sputtered AlN buffers to be used for subsequent growth of GaN-based structures by conventional techniques, such as metal-organic chemical vapor deposition (MOCVD), hydride vapor phase epitaxy (HYPE), or molecular beam epitaxy (MBE), and (2) deposition of the entire III-nitride layered stacks and device structures by sputtering. Replacing conventional in situ GaN or AlN buffer layers with ex situ sputtered AlN buffers for MOCVD, HYPE, or MBE growth of III-nitride films on sapphire and silicon substrates results in the improved crystal quality through reduction in dislocation density and residual strain. Extensive efforts in the field of sputter deposition of III-nitrides resulted in crystalline quality of sputtered III-nitride films compatible with that of MOCVD and MBE grown layers despite the lower temperatures used in sputtering. For example, sputtering techniques made it possible to achieve GaN layers heavily doped with Si and Ge to electron concentrations in mid-10(20) cm(-3) range with mobilities exceeding 100 cm(2)V(-1)s(-1), resulting in conductivities as high as those of benchmark transparent conducting oxides such as indium tin oxide (ITO). For moderate levels of doping with Si, mobilities comparable to state-of-the-art MOCVD-grown material have been demonstrated (up to similar to 1000 cm(2)V(-1)s(-1)). The first promising results have been reported for devices (light emitters and field effect transistors) entirely produced by sputtering.
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页数:23
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