Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

被引：7
|
作者：
Broll, M. S. [1 ]
Geissler, U. [1 ]
Hoefer, J. [2 ]
Schmitz, S. [2 ]
Wittler, O. [2 ]
Schneider-Ramelow, M. [2 ]
Lang, K. D. [1 ]
机构：
[1] Tech Univ Berlin, Res Ctr Micropheripher Technol, D-13355 Berlin, Germany
[2] Fraunhofer Inst Reliabil & Microintegrat IZM, D-13355 Berlin, Germany
来源：
MICROELECTRONICS RELIABILITY | 2015年 / 55卷 / 9-10期
关键词：
Ultrasonic wire bonding; Electron backscatter diffraction (EBSD); Hardness; Aluminum; POWER IGBT MODULES; RELIABILITY;
D O I：
10.1016/j.microrel.2015.06.061
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Three different heavy aluminum wire qualities were investigated regarding their microstructural evolution after ultrasonic bonding by electron backscatter diffraction and nanoindentation. The results complete the findings of our recent research regarding the effect of bonding mechanisms on the wire bond microstructure and its local mechanical properties. Local elastic-plastic material parameters of the bonded wires were approximated on the basis of the elastic anisotropy of crystals and a correlation between hardness and stress. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1855 / 1860
页数：6
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