Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding

被引：7
|
作者：
Broll, M. S. [1 ]
Geissler, U. [1 ]
Hoefer, J. [2 ]
Schmitz, S. [2 ]
Wittler, O. [2 ]
Schneider-Ramelow, M. [2 ]
Lang, K. D. [1 ]
机构：
[1] Tech Univ Berlin, Res Ctr Micropheripher Technol, D-13355 Berlin, Germany
[2] Fraunhofer Inst Reliabil & Microintegrat IZM, D-13355 Berlin, Germany
来源：
MICROELECTRONICS RELIABILITY | 2015年 / 55卷 / 9-10期
关键词：
Ultrasonic wire bonding; Electron backscatter diffraction (EBSD); Hardness; Aluminum; POWER IGBT MODULES; RELIABILITY;
D O I：
10.1016/j.microrel.2015.06.061
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Three different heavy aluminum wire qualities were investigated regarding their microstructural evolution after ultrasonic bonding by electron backscatter diffraction and nanoindentation. The results complete the findings of our recent research regarding the effect of bonding mechanisms on the wire bond microstructure and its local mechanical properties. Local elastic-plastic material parameters of the bonded wires were approximated on the basis of the elastic anisotropy of crystals and a correlation between hardness and stress. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1855 / 1860
页数：6
相关论文
共 50 条
  • [1] The Correlation Between Dielectric Properties and Microstructure of Femoral Bone in Rats with Different Bone Qualities
    Feng Tao
    Feng Fu
    Fusheng You
    Zhenyu Ji
    Jun Wen
    Xuetao Shi
    Xiuzhen Dong
    Min Yang
    Annals of Biomedical Engineering, 2014, 42 : 1238 - 1249
  • [2] The Correlation Between Dielectric Properties and Microstructure of Femoral Bone in Rats with Different Bone Qualities
    Tao, Feng
    Fu, Feng
    You, Fusheng
    Ji, Zhenyu
    Wen, Jun
    Shi, Xuetao
    Dong, Xiuzhen
    Yang, Min
    ANNALS OF BIOMEDICAL ENGINEERING, 2014, 42 (06) : 1238 - 1249
  • [3] DEFORMATION AND BONDING PROCESSES IN ALUMINUM ULTRASONIC WIRE WEDGE BONDING
    KRZANOWSKI, JE
    MURDESHWAR, N
    JOURNAL OF ELECTRONIC MATERIALS, 1990, 19 (09) : 919 - 928
  • [4] Effect of Mechanical Characteristics of Gold Wire on Microstructure and Properties of Ball Bonding
    Feifei, Kang
    Wenyan, Zhou
    Jianshu, Yu
    Xingqiao, Ji
    Jia, Wang
    Xubo, Chen
    Jianqiang, Luo
    Chen, Liang
    Yongjin, Wu
    Hongying, Pei
    Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 51 (10): : 3632 - 3637
  • [5] Microstructure and mechanical properties of 2219 aluminum alloy manufactured by ultrasonic vibration assisted wire and arc additively manufacturing
    Li P.
    Guo S.
    Yang D.-Q.
    Peng Y.
    Yan D.-J.
    Li D.
    Wang K.-H.
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2023, 33 (07): : 2081 - 2089
  • [6] Mechanical properties and microstructure of Ca-doped gold bonding wire
    Saraswati
    Sritharan, T
    Breach, CD
    Wulff, F
    Mhaisalkar, SG
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 569 - 573
  • [7] Effect of Mechanical Characteristics of Gold Wire on Microstructure and Properties of Ball Bonding
    Kang, Feifei
    Zhou, Wenyan
    Yu, Jianshu
    Ji, Xingqiao
    Jia, Wang
    Chen, Xubo
    Luo, Jianqiang
    Chen, Liang
    Wu, Yongjin
    Pei, Hongying
    RARE METAL MATERIALS AND ENGINEERING, 2022, 51 (10) : 3632 - 3637
  • [8] ULTRASONIC ALUMINUM WIRE BONDING TO COPPER CONDUCTORS.
    Pitt, V.A.
    Needes, C.R.S.
    Johnson, R.W.
    Insulation, circuits, 1981, 27 (12): : 51 - 55
  • [9] DEFORMATION CHARACTERISTICS AND BONDING PROCESS OF FINE ALUMINUM WIRE IN ULTRASONIC BONDING
    KASHIWABARA, M
    HATTORI, S
    AOKI, T
    SAITO, Y
    REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1971, 19 (7-8): : 791 - +
  • [10] Deformation characteristics and bonding process of fine aluminum wire in ultrasonic bonding
    KASHIWABARA M
    HATTORI S
    AOKI T
    SAITO Y
    1971, 19 (7-8): : 791 - 797
12345