Tensor decomposition-based 3D positioning with a single-antenna receiver in 5G millimetre wave systems

被引:1
|
作者
Dan, Zesheng [1 ]
Lian, Baowang [1 ]
Tang, Chengkai [1 ]
Xu, Haowei [1 ]
机构
[1] Northwestern Polytech Univ, YouYi West Rd 127, Xian, Peoples R China
关键词
matrix decomposition; 5G mobile communication; wireless channels; mean square error methods; array signal processing; compressed sensing; millimetre wave receivers; radio receivers; millimetre wave antenna arrays; time-of-arrival estimation; channel estimation; 5G mmWave systems; tensor decomposition-based 3D positioning; single-antenna receiver; 5G millimetre wave systems; three-dimensional positioning; millimetre-wave system; massive antenna arrays; fifth-generation base stations; high-precision positioning; single antenna; mmWave channel; compressed sensing-based algorithm; third-order low-rank tensor structure; CAMDECOMP; PARAFAC decomposition; Cramer-Rao bound; 5G base station; time of arrival; CHANNEL ESTIMATION; MIMO SYSTEMS; LOCALIZATION; EFFICIENCY; ENERGY; BOUNDS;
D O I
10.1049/iet-com.2019.1254
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Exploiting a single-antenna receiver to realise three-dimensional (3D) positioning in a millimetre-wave (mmWave) system is considered. The primary motivation is that the massive antenna arrays will be deployed in the fifth-generation (5G) base stations shortly soon, which not only tremendously promote the data transmission rate, but also enable the user equipment to realise high-precision positioning with a single antenna. Based on the sparsity of the mmWave channel, the tensor decomposition is proposed to be utilised as an effective mathematical tool to realise 3D positioning. Specifically, the authors model the received signals as a third-order tensor for the inherent third-order low-rank tensor structure of the mmWave channel with a single-antenna receiver and then, the positioning parameters (including the angles of departure and the time of arrival) are estimated from the corresponding factor matrices via CAMDECOMP/PARAFAC (CP) decomposition. Moreover, Cramer-Rao bounds (CRBs) on 3D position uncertainty are derived. Numerical results demonstrate that the proposed method based on CP decomposition realises nearly the same positioning accuracy as the state-of-the-art compressed sensing-based algorithm in the 5G mmWave systems with lower computation complexity, and the root mean square errors of the 3D positioning results obtained via the proposed approach are close to their CRBs.
引用
收藏
页码:3619 / 3630
页数:12
相关论文
共 50 条
  • [41] Metasurface-Based Single-Layer Wideband Circularly Polarized MIMO Antenna for 5G Millimeter-Wave Systems
    Hussain, Niamat
    Jeong, Min-Joo
    Abbas, Anees
    Kim, Nam
    IEEE ACCESS, 2020, 8 : 130293 - 130304
  • [42] RETRACTED ARTICLE: Unmanned Vehicle Fusion Positioning Technology Based on “5G + Beidou” and 3D Point Cloud Image
    Siyong Fu
    Qinghua Zhao
    Zhen Fan
    Qiuxiang Tao
    Hesheng Liu
    International Journal of Computational Intelligence Systems, 16
  • [43] Retraction Note: Unmanned Vehicle Fusion Positioning Technology Based on “5G + Beidou” and 3D Point Cloud Image
    Siyong Fu
    Qinghua Zhao
    Zhen Fan
    Qiuxiang Tao
    Hesheng Liu
    International Journal of Computational Intelligence Systems, 17
  • [44] 3D Beamforming Technologies and Field Trials in 5G Massive MIMO Systems
    Wang, Jiangzhou
    Deng, Wei
    Li, Xin
    Zhu, Huiling
    Nair, Manish
    Chen, Tao
    Yi, Na
    Gomes, Nathan J.
    IEEE OPEN JOURNAL OF VEHICULAR TECHNOLOGY, 2020, 1 : 362 - 371
  • [45] 3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications
    Watanabe, Atom O.
    Lin, Tong-Hong
    Ali, Muhammad
    Ogawa, Tomonori
    Raj, P. Markondeya
    Tentzeris, Manos M.
    Tummala, Rao R.
    Swaminathan, Madhavan
    2019 IEEE MTT-S INTERNATIONAL MICROWAVE CONFERENCE ON HARDWARE AND SYSTEMS FOR 5G AND BEYOND (IMC-5G), 2019,
  • [46] Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates
    Ali, Muhammad
    Watanabe, Atom
    Kakutani, Takenori
    Raj, Pulugurtha M.
    Tummala, Rao R.
    Swaminathan, Madhavan
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1376 - 1382
  • [47] Integrated 3D Fan-out Package of RF Microsystem and Antenna for 5G Communications
    XIA Chenhui
    WANG Gang
    WANG Bo
    MING Xuefei
    ZTE Communications, 2020, 18 (03) : 33 - 41
  • [48] Integrated 3D Fan-Out Package of RF Microsystem and Antenna for 5G Communication
    Xia C.-H.
    Wang G.
    Wang B.
    Ming X.-F.
    Tien Tzu Hsueh Pao/Acta Electronica Sinica, 2023, 51 (06): : 1572 - 1580
  • [49] Innovative Packaging Solutions of 3D System in Package with Antenna Integration for IoT and 5G Application
    Tsai, Mike
    Chiu, Ryan
    He, Eric
    Chen, J. Y.
    Chen, Royal
    Tsai, Jensen
    Wang, Yu-Po
    2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2018, : 1 - 7
  • [50] 3D-Printed Dielectric Bifunctional Metasurface Antenna for Millimeter-Wave 5G Communication
    Tiwari, Suchitra
    Singh, Amit K.
    Dubey, Ankit
    2024 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION AND INC/USNCURSI RADIO SCIENCE MEETING, AP-S/INC-USNC-URSI 2024, 2024, : 1573 - 1574